DAC1203D160HW NXP [NXP Semiconductors], DAC1203D160HW Datasheet
DAC1203D160HW
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DAC1203D160HW Summary of contents
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DAC1203D160 Dual 12 bits DAC 160 MHz interpolating Rev. 02 — 14 August 2008 1. General description The DAC1203D160 is optimized to reduce architecture complexity and overall system cost. The Digital-to-Analog Converter (DAC) leads dynamic performance ...
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... NXP Semiconductors 4. Ordering information Table 1. Ordering information Type number Package Name DAC1203D160HW HTQFP80 5. Block diagram (1) Pins 1, 3, 61, 65, 76 and 80. (2) Pins 4, 7, 62, 64, 66, 67, 70, 71, 74, 75, 77 and 79. (3) Pins 9, 17, 25, 29, 30, 35, 44, 49, 50, 52, 53, 54, 55 and 56. (4) Pins 18, 26, 36, 43, 63 and 78. ...
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... Symbol V CCA i.c. V CCA AGND CLK CLKN AGND i.c. DGND DAC1203D160_2 Product data sheet Dual 12 bits DAC 160 MHz interpolating DAC1203D160HW I11 11 I10 DGND Pin description [1] Pin Type Description 1 S ...
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NXP Semiconductors Table 2. Symbol V CCD I11 I10 DGND DEC DGND DEC n.c. n.c. DGND DGND Q11 Q10 Q9 Q8 DGND DEC DEC ...
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NXP Semiconductors Table 2. Symbol V CCD DGND DGND DGND DGND DGND GAPD GAPOUT QVIRES IVIRES V CCA AGND DEC AGND V CCA AGND AGND QOUTN QOUT AGND AGND IOUTN IOUT AGND AGND V CCA AGND DEC AGND V CCA ...
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NXP Semiconductors 7. Functional description The DAC1203D160 is a segmented architecture composed of a 7-bit thermometer sub-DAC and the remaining 5-bit in a binary weighted sub-DAC. The device produces two complementary current outputs on both channels, respectively pins IOUT/IOUTN and ...
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NXP Semiconductors 8. Limiting values Table 3. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol V CCD V CCA stg T amb T j [1] All supplies are connected together. ...
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NXP Semiconductors 10. Characteristics Table 5. Characteristics 3 3.6 V; AGND and DGND connected together; T CCD CCA 3 and T CCD CCA O(fs) Figure ...
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NXP Semiconductors Table 5. Characteristics …continued 3 3.6 V; AGND and DGND connected together; T CCD CCA 3 and T CCD CCA O(fs) Figure 10; ...
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NXP Semiconductors Table 5. Characteristics …continued 3 3.6 V; AGND and DGND connected together; T CCD CCA 3 and T CCD CCA O(fs) Figure 10; ...
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NXP Semiconductors 20 output (dB 100 140 180 0 0.2 0.4 normalized frequency f Fig 6. FIR filter frequency response Table 7. Coefficient H(1) H(2) H(3) H(4) H(5) H(6) H(7) H(8) H(9) H(10) H(11) H(12) H(13) H(14) H(15) ...
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NXP Semiconductors 11. Application information R s CLK V CCA 1 k CLKN 100 AGND 004aaa547 Fig 8. Single-ended clock schematic DAC1203D160_2 Product data sheet Dual 12 bits DAC 160 MHz ...
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NXP Semiconductors AGND 3 CCA 1 3 CCA 3 3 ...
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NXP Semiconductors 11.1 Alternative parts The following alternative parts are also available: Table 8. Type number DAC1403D160 DAC1003D160 [1] Pin to pin compatible DAC1203D160_2 Product data sheet Dual 12 bits DAC 160 MHz interpolating Alternative parts ...
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NXP Semiconductors 12. Package outline HTQFP80: plastic thermal enhanced thin quad flat package; 80 leads; body mm; exposed die pad y exposed die pad pin 1 index ...
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NXP Semiconductors 13. Abbreviations Table 9. Acronym FIR IF LSB MSB PLL PMOS 14. Glossary 14.1 Static parameters DNL — Differential Non-Linearity. The difference between the ideal and the measured output value between successive DAC codes. INL — Integral Non-Linearity. ...
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NXP Semiconductors 15. Revision history Table 10. Revision history Document ID Release date DAC1203D160_2 20080814 • Modifications: Corrections to values in • Addition to description of row Q0 in • Corrections to row sequence in • Corrections to n.c pins ...
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NXP Semiconductors 16. Legal information 16.1 Data sheet status [1][2] Document status Product status Objective [short] data sheet Development Preliminary [short] data sheet Qualification Product [short] data sheet Production [1] Please consult the most recently issued document before initiating or ...
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NXP Semiconductors 18. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . ...