SAA7127 PHILIPS [NXP Semiconductors], SAA7127 Datasheet - Page 37

• Manufacturer Part Number: SAA7127
• Description: Digital video encoder
• Manufacturer: PHILIPS [NXP Semiconductors]

Philips Semiconductors
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
3. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
1999 May 31
BGA, SQFP
HLQFP, HSQFP, HSOP, HTSSOP, SMS not suitable
PLCC
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
Digital video encoder
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods” .
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
The package footprint must incorporate solder thieves downstream and at the side corners.
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
(3)
, SO, SOJ
PACKAGE
not suitable
suitable
not recommended
not recommended
(2)
WAVE
37
(3)(4)
(5)
SOLDERING METHOD
SAA7126H; SAA7127H
suitable
suitable
suitable
suitable
suitable
REFLOW
Product specification
(1)