CY8C20111_12 CYPRESS [Cypress Semiconductor], CY8C20111_12 Datasheet - Page 26

• Manufacturer Part Number: CY8C20111_12
• Manufacturer: CYPRESS [Cypress Semiconductor]

Layout Guidelines and Best Practices
Table 2. Layout Guidelines and Best Practices
The Recommended maximum overlay thickness is 2 mm. For more details refer to the section “The Integrating Capacitor (Cint)” in
AN53490.
Document Number: 001-53516 Rev. *H
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
Sl. No.
Button Shape
Button Size
Button Button Spacing
Button Ground Clearance
Ground Flood – Top Layer
Ground Flood – Bottom Layer
Trace Length from Sensor to
PSoC - Buttons
Trace Width
Trace Routing
Via Position for the Sensors
Via Hole Size for Sensor Traces
No. of Via on Sensor Trace
CapSense Series Resistor
Placement
Distance between any CapSense
Trace to Ground Flood
Device Placement
Placement of Components in 2
Layer PCB
Placement of Components in 4
Layer PCB
Overlay Material
Overlay Adhesives
LED Back Lighting
Board Thickness
Category
Clearance
= Button
0.17 mm
Ground
0.5 mm
10 mil
5 mm
Min
–
–
–
–
–
–
–
1
–
–
–
–
–
–
–
–
0.20 mm
200 mm
15 mm
10mm
20 mil
2 mm
Max
–
–
–
–
–
–
–
2
–
–
–
–
–
–
–
Hatched ground 7 mil trace and 70 mil grid (10% filling)
Via should be placed near the edge of the button/slider to
Adhesive should be non conductive and dielectrically
Standard board thickness for CapSense FR4 based designs is
Solid round pattern, round with LED hole, rectangle with round
corners
10 mm
8 mm
Button ground clearance = Overlay Thickness
Hatched ground 7 mil trace and 45 mil grid (15% filling)
< 100 mm.
0.17 mm (7 mil)
Traces should be routed on the non sensor side. If any non
CapSense trace crosses CapSense trace, ensure that
intersection is orthogonal.
reduce trace length thereby increasing sensitivity.
10 mil
1
Place CapSense series resistors close to PSoC for noise
suppression.CapSense resistors have highest priority place
them first.
20 mil
Mount the device on the layer opposite to sensor. The
CapSense trace length between the device and sensors should
be minimum
Top layer-sensor pads and bottom layer-PSoC, other
components and traces.
Top layer-sensor pads, second layer – CapSense traces, third
layer-hatched ground, bottom layer- PSoC, other components
and non CapSense traces
Should to be non conductive material. Glass, ABS Plastic,
Formica
homogenous. 467MP and 468MP adhesives made by 3M are
recommended.
Cut a hole in the sensor pad and use rear mountable LEDs.
Refer
Buttons and Two LEDs on page
1.6 mm.
Example PCB Layout Design with Two CapSense
Recommendations/Remarks
CY8C20111, CY8C20121
28.
Page 26 of 44