CY8C20X36A CYPRESS [Cypress Semiconductor], CY8C20X36A Datasheet - Page 34

• Manufacturer Part Number: CY8C20X36A
• Description: CapSense Applications Operating Range: 1.71 V to 5.5 V
• Manufacturer: CYPRESS [Cypress Semiconductor]

Thermal Impedances
Table 34. Thermal Impedances per Package
Capacitance on Crystal Pins
Table 35. Typical Package Capacitance on Crystal Pins
Solder Reflow Peak Temperature
This table lists the minimum solder reflow peak temperature to achieve good solderability.
Table 36. Solder Reflow Peak Temperature
Document Number: 001-54459 Rev. *E
Note
42. T
43. To achieve the thermal impedance specified for the QFN package, the center thermal pad must be soldered to the PCB ground plane.
44. Higher temperatures may be required based on the solder melting point. Typical temperatures for solder are 220 ± 5
paste. Refer to the solder manufacturer specifications
J
= T
30 Ball WLCSP
A
30 Ball WLCSP
24 Pin QFN
32 Pin QFN
48 Pin QFN
48 Pin SSOP
48 Pin SSOP
+ Power × θ
16 Pin QFN
24 Pin QFN
32 Pin QFN
48 Pin QFN
16 Pin QFN
32 Pin QFN
48 Pin QFN
Package
Package
Package
JA
[43]
[43]
[43]
.
Minimum Peak Temperature
Package Capacitance
Typical θ
33 °C/W
21 °C/W
20 °C/W
69 °C/W
18 °C/W
54 °C/W
240 °C
240 °C
240 °C
220 °C
240 °C
240 °C
3.2 pF
3.3 pF
JA
[42]
[44]
Maximum Peak Temperature
CY8C20X36A/46A/66A/96A
260 °C
260 °C
260 °C
260 °C
260 °C
260 °C
o
C with Sn-Pb or 245 ± 5
o
C with Sn-Ag-Cu
Page 34 of 43
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