MC68HC11F1CPU2 FREESCALE [Freescale Semiconductor, Inc], MC68HC11F1CPU2 Datasheet - Page 136

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MC68HC11F1CPU2

Manufacturer Part Number
MC68HC11F1CPU2
Description
MC68HC11F1 Technical Data
Manufacturer
FREESCALE [Freescale Semiconductor, Inc]
Datasheet
Average Junction Temperature
Ambient Temperature
Package Thermal Resistance (Junction-to-Ambient)
68-Pin Plastic Leaded Chip Carrier
80-Pin Low Profile Quad Flat Pack (LQFP, 1.4 mm Thick)
Total Power Dissipation
Device Internal Power Dissipation
I/O Pin Power Dissipation
A Constant
A-2
NOTES:
1 This is an approximate value, neglecting P
2. For most applications P
3. K is a constant pertaining to the device. Solve for K with a known T
this value of K to solve for P
Characteristic
Freescale Semiconductor, Inc.
I/O
For More Information On This Product,
Table A-2 Thermal Characteristics
« P
D
ELECTRICAL CHARACTERISTICS
and T
INT
and can be neglected.
Go to: www.freescale.com
J
iteratively for any value of T
(Note 1)
(Note 2)
(Note 3)
I/O
.
Symbol
P
Q
P
P
T
T
K
INT
I/O
JA
A
D
J
A
A
and a measured P
P
D
User-determined
User-determined
K / (T
T
x (T
A
P
Q
I
+ (P
DD
INT
JA
Value
A
J
50
80
+ 273 C)
x V
+ 273 C) +
x P
D
+ P
x Q
DD
D
I/O
2
JA
TECHNICAL DATA
)
D
(at equilibrium. Use
MC68HC11F1
W x C
Unit
C/W
C/W
W
W
W
C
C

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