PALCE29M16H-25 AMD [Advanced Micro Devices], PALCE29M16H-25 Datasheet - Page 22

• Manufacturer Part Number: PALCE29M16H-25
• Description: 24-Pin EE CMOS Programmable Array Logic
• Manufacturer: AMD [Advanced Micro Devices]

TYPICAL THERMAL CHARACTERISTICS
Measured at 25 C ambient. These parameters are not tested.
Plastic jc Considerations
The data listed for plastic jc are for reference only and are not recommended for use in calculating junction temperatures. The
heat-flow paths in plastic-encapsulated devices are complex, making the jc measurement relative to a specific location on the
package surface. Tests indicate this measurement reference point is directly below the die-attach area on the bottom center of the
package. Furthermore, jc tests on packages are performed in a constant-temperature bath, keeping the package surface at a
constant temperature. Therefore, the measurements can only be used in a similar environment.
2-348
Parameter
Symbol
AMD
jma
jc
ja
Parameter Description
Thermal Impedance, Junction to Case
Thermal Impedance, Junction to Ambient
Thermal Impedance, Junction to Ambient with Air Flow
PALCE29M16H-25
200 Ifpm air
400 Ifpm air
600 Ifpm air
800 Ifpm air
SKINNYDIP
17
63
60
52
43
39
Typ
PLCC
11
51
43
38
34
30
Unit
C/W
C/W
C/W
C/W
C/W
C/W