LAN8187_06 SMSC [SMSC Corporation], LAN8187_06 Datasheet - Page 63

• Manufacturer Part Number: LAN8187_06
• Manufacturer: SMSC [SMSC Corporation]

±15kV ESD Protected MII/RMII Fast-Ethernet PHY with HP Auto-MDIX and SMSC flexPWR
Datasheet
Chapter 7 DC Electrical Characteristics
SMSC LAN8187/LAN8187I
7.1
7.1.1
7.1.1.1
Parameter
VDD33,VDDIO
Digital IO
VSS
Operating
Temperature
Operating
Temperature
Storage
Temperature
Parameter
ESD PERFORMANCE
All Pins
All Pins
All Pins
LATCH-UP PERFORMANCE
All Pins
Maximum Guaranteed Ratings
Stresses beyond those listed in
absolute maximum rating conditions for extended periods may affect device reliability.
Human Body Model (HBM) Performance
HBM testing verifies the ability to withstand the ESD strikes like those that occur during handling and
manufacturing. The device must work normally after the stress has ended, meaning no latch-up on any
pins. All pins on the LAN8187 provide +/- 8kV HBM protection.
DC Characteristics
Human Body Model
IED61000-4-2 Contact Discharge
IEC61000-4-2 Air-gap Discharge
EIA/JESD 78, Class II
Power pins to all other pins.
To VSS ground
VSS to all other pins
LAN8187-JT
LAN8187I-JT
Conditions
Conditions
Table 7.2 ESD and LATCH-UP Performance
Table 7.1 Maximum Conditions.
Table
DATASHEET
MIN
-0.5
-0.5
-0.5
-40
-55
0
7.1may cause permanent damage to the device. Exposure to
MIN
63
TYP
TYP
+3.6
+3.6
+4.0
+70
+85
+15
MA
TM
X
0
+/-8
+/-8
100
MA
+/-
15
X
V
V
V
C
C
C
UNIT
S
kV
kV
kV
mA
UNIT
S
Table 7.5, “MII Bus
Interface Signals,” on
page 66
parts.
Industrial temperature
parts.
Commercial temperature
Revision 1.0 (12-14-06)
Comment
Comments