UJA1078 NXP [NXP Semiconductors], UJA1078 Datasheet - Page 49

• Manufacturer Part Number: UJA1078
• Description: High-speed CAN/dual LIN core system basis chip
• Manufacturer: NXP [NXP Semiconductors]

NXP Semiconductors
UJA1078_2
Product data sheet
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
Fig 21. Temperature profiles for large and small components
temperature
MSL: Moisture Sensitivity Level
All information provided in this document is subject to legal disclaimers.
Rev. 02 — 27 May 2010
= minimum soldering temperature
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
High-speed CAN/dual LIN core system basis chip
temperature
peak
UJA1078
© NXP B.V. 2010. All rights reserved.
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