ISL6251 INTERSIL [Intersil Corporation], ISL6251 Datasheet - Page 3

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ISL6251

Manufacturer Part Number
ISL6251
Description
Low Cost Multi-Chemistry Battery Charger Controller
Manufacturer
INTERSIL [Intersil Corporation]
Datasheet

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Electrical Specifications
Absolute Maximum Ratings
DCIN, CSIP, CSON to GND. . . . . . . . . . . . . . . . . . . . . -0.3V to +28V
CSIP-CSIN, CSOP-CSON . . . . . . . . . . . . . . . . . . . . . -0.3V to +0.3V
PHASE to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -7V to 30V
BOOT to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +35V
BOOT-PHASE, VDD-GND, VDDP-PGND,
ACSET to GND (Note 3) . . . . . . . . . . . . . . . . . . -0.3V to VDD+0.3V
ICM, ICOMP, VCOMP to GND. . . . . . . . . . . . . . -0.3V to VDD+0.3V
ACLIM, CHLIM, VREF, CELLS to GND . . . . . . . -0.3V to VDD+0.3V
EN, VADJ, PGND to GND . . . . . . . . . . . . . . . . . .-0.3V to VDD+0.3V
UGATE. . . . . . . . . . . . . . . . . . . . . . . . . PHASE-0.3V to BOOT+0.3V
LGATE . . . . . . . . . . . . . . . . . . . . . . . . . . PGND-0.3V to VDDP+0.3V
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
SUPPLY AND BIAS REGULATOR
DCIN Input Voltage Range
DCIN Quiescent Current
Battery Leakage Current (Note 7)
VDD Output Voltage/Regulation
VDD Undervoltage Lockout Trip Point
Reference Output Voltage VREF
Battery Charge Voltage Accuracy
TRIP POINTS
ACSET Threshold
ACSET Input Bias Current Hysteresis
ACSET Input Bias Current
ACSET Input Bias Current
3. When the voltage across ACSET is below 0V, the current through ACSET should be limited to less than 1mA.
4. θ
5. θ
6. For θ
ACPRN to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V
Brief TB379.
JA
JA
is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech
is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
JC
, the “case temp” location is the center of the exposed metal pad on the package underside.
PARAMETER
3
DCIN=CSIP=CSIN=18V, CSOP=CSON=12V, ACSET=1.5V, ACLIM=VREF, VADJ=Floating, EN=VDD=5V,
BOOT-PHASE=5.0V, GND=PGND=0V, C
otherwise noted.
EN=VDD or GND, 7V ≤ DCIN ≤ 25V
DCIN=0, no load
7V ≤ DCIN ≤ 25V, 0 ≤ I
VDD Rising
Hysteresis
0 ≤ I
CSON=16.8V, CELLS=VDD, VADJ=Float
CSON=12.6V, CELLS=GND, VADJ=Float
CSON=8.4V, CELLS=Float, VADJ=Float
CSON=17.64V, CELLS=VDD, VADJ=VREF
CSON=13.23V, CELLS=GND, VADJ=VREF
CSON=8.82V, CELLS=Float, VADJ=VREF
CSON=15.96V, CELLS=VDD, VADJ=GND
CSON=11.97V, CELLS=GND, VADJ=GND
CSON=7.98V, CELLS=Float, VADJ=GND
ACSET ≥ 1.26V
ACSET < 1.26V
VREF
≤ 300µA
TEST CONDITIONS
ISL6251, ISL6251A
VDD
≤ 30mA
VDD
Thermal Information
Thermal Resistance
ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Level 2
Junction Temperature Range. . . . . . . . . . . . . . . . . .-10°C to +150°C
Operating Temperature Range . . . . . . . . . . . . . . . .-10°C to +100°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C
Lead Temperature (soldering, 10s) . . . . . . . . . . . . . . . . . . . . +300°C
QFN Package (Notes 4, 6). . . . . . . . . .
QSOP Package (Note 5) . . . . . . . . . . .
=1µF, I
VDD
4.925
2.365
=0mA, T
1.24
MIN
200
-0.5
-0.5
-0.5
-0.5
-0.5
-0.5
-0.5
-0.5
-0.5
4.0
2.2
2.2
-1
7
A
=-10°C to +100°C, T
5.075
TYP
2.39
1.26
250
4.4
1.4
3.4
3.4
3
0
θ
5.225
2.415
MAX
JA
1.28
400
J
4.6
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
4.4
4.4
25
10
3
1
(°C/W)
39
88
125°C, unless
June 17, 2005
θ
UNITS
JC
mA
mV
µA
µA
µA
µA
%
%
%
%
%
%
%
%
%
N/A
V
V
V
V
V
FN9202.1
9.5
(°C/W)

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