ICL3232E INTERSIL [Intersil Corporation], ICL3232E Datasheet - Page 25

• Manufacturer Part Number: ICL3232E
• Manufacturer: INTERSIL [Intersil Corporation]

N
1
Thin Shrink Small Outline Plastic Packages (TSSOP)
NOTES:
10. Controlling dimension: MILLIMETER. Converted inch dimen-
1. These package dimensions are within allowable dimensions of
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
4. Dimension “E1” does not include interlead flash or protrusions.
5. The chamfer on the body is optional. If it is not present, a visual
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable
0.10(0.004)
2
-A-
INDEX
AREA
JEDEC MO-153-AB, Issue E.
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
Interlead flash and protrusions shall not exceed 0.15mm (0.006
inch) per side.
index feature must be located within the crosshatched area.
dambar protrusion shall be 0.08mm (0.003 inch) total in excess
of “b” dimension at maximum material condition. Minimum space
between protrusion and adjacent lead is 0.07mm (0.0027 inch).
sions are not necessarily exact. (Angles in degrees)
3
e
b
0.05(0.002)
D
ICL3221E, ICL3222E, ICL3223E, ICL3232E, ICL3241E, ICL3243E
M
C A
SEATING PLANE
M
E1
-C-
-B-
B S
A
25
A1
E
α
0.10(0.004)
0.25(0.010)
GAUGE
PLANE
0.010
A2
0.25
M
B
M
L
c
M16.173
16 LEAD THIN SHRINK SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
A1
A2
E1
D
N
α
A
b
e
E
L
c
0.002
0.033
0.0075
0.0035
0.193
0.169
0.246
0.020
MIN
0
-
0.026 BSC
o
INCHES
16
0.006
MAX
0.043
0.037
0.012
0.008
0.201
0.177
0.256
0.028
8
o
0.05
0.85
0.19
0.09
4.90
4.30
6.25
0.50
MILLIMETERS
MIN
0
-
o
0.65 BSC
16
MAX
1.10
0.15
0.95
0.30
0.20
5.10
4.50
6.50
0.70
8
o
February 22, 2010
Rev. 1 2/02
FN4910.21
NOTES
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