HSDL-3220-001 HP [Agilent(Hewlett-Packard)], HSDL-3220-001 Datasheet - Page 9

• Manufacturer Part Number: HSDL-3220-001
• Manufacturer: HP [Agilent(Hewlett-Packard)]

9
Moisture Proof Packaging
All HSDL-3220 options are
shipped in moisture proof
package. Once opened, moisture
absorption begins.
Figure 11. Baking conditions chart.
IS NECESSARY
NO BAKING
YES
PERFORM RECOMMENDED
OPENED (UNSEALED)
BAKING CONDITIONS
UNITS IN A SEALED
MOISTURE-PROOF
LESS THAN 30°C,
AND LESS THAN
THAN 72 HOURS
ENVIRONMENT
OPENED LESS
PACKAGE IS
PACKAGE IS
PACKAGE
60% RH
YES
NO
This part is compliant to JEDEC
Level 4.
NO
Baking Conditions
If the parts are not stored in dry
conditions, they must be baked
before reflow to prevent damage
to the parts.
Package
In reels
In bulk
Baking should only be done once.
Recommended Storage Conditions
Storage Temperature
Relative Humidity
Time from Unsealing to Soldering
After removal from the bag, the
parts should be soldered within
three days if stored at the recom-
mended storage conditions. If
times longer than three days are
needed, the parts must be stored
in a dry box.
Temp.
100°C
125°C
150°C
60°C
10°C to 30°C
below 60% RH
Time
≥ 48 hours
≥ 4 hours
≥ 2 hours
≥ 1 hour