ISD-T360 ETC [List of Unclassifed Manufacturers], ISD-T360 Datasheet - Page 14

• Manufacturer Part Number: ISD-T360
• Description: VoiceDSP Digital Speech Processor with Master/Slave, Full-Duplex Speakerphone, Multiple Flash and ARAM/DRAM Support
• Manufacturer: ETC [List of Unclassifed Manufacturers]

For optimal noise immunity, the power and
ground pins should be connected to V
the ground planes, respectively, on the printed
circuit board. If V
not used, single conductors should be run direct-
ly from each V
each GND pin to a ground point. Avoid daisy-
chained connections. The VoiceDSP does not
perform its usual functions in power-down mode
but it still preserves stored messages, maintains
the time of day and generates ARAM/DRAM re-
fresh cycles.
When you build a prototype, using wire-wrap or
other methods, solder the capacitors directly to
the power pins of the VoiceDSP processor sock-
et, or as close as possible, with very short leads.
1-6
CC
CC
pin to a power point, and from
and the ground planes are
C
2
Figure 1-6: 5 V Power Connection Diagram
5 V Supply
V
V
V
CC
SS
CC
HI
V
9
11
12
SS
CC
74
V
V
CC
and
C
CC
30
5
72
ISD-T360
V
CC
C
64
3
V
1.2.5
Flash Support
The ISD-T360SB VoiceDSP supports Flash devices
for storing recorded data, thus, power can be
disconnected to the ISD-T360SB without losing
data. The ISD-T360SB supports serial and semi-
parallel
TC58V16BFT, TC5816BFT, TC58A040F, KM29N040T,
KM2928000T/IT, and KM29216000AT/AIT. The ISD-
T360SB may be connected to up to four Flash de-
vices, resulting with maximum recording storage
of 16-Mbits x 4 = 64 Mbits (up to 4 hours of record-
ing time).
The following flash devices are supported:
R
CC
2
V
63
A
SS
32
C
6
60
50
48
61
V
MEMORY INTERFACE
SS
V
V
V
Flash
SS
SS
CC
C
A
7
C
device
4
Voice Solutions in Silicon
interfaces,
1—HARDWARE
such
as
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