ADA4896-2ACP-EBZ AD [Analog Devices], ADA4896-2ACP-EBZ Datasheet - Page 8

• Manufacturer Part Number: ADA4896-2ACP-EBZ
• Description: 1 nV/?Hz, Low Power
• Manufacturer: AD [Analog Devices]

ADA4896-2/ADA4897-1/ADA4897-2
ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter
Supply Voltage
Power Dissipation
Common-Mode Input Voltage
Differential Input Voltage
Storage Temperature Range
Operating Temperature Range
Lead Temperature (Soldering 10 sec)
Junction Temperature
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
specified for a device soldered in a circuit board for surface-
mount packages. Table 7 lists the θ
ADA4897-1/ADA4897-2.
Table 7. Thermal Resistance
Package Type
8-Lead Dual MSOP (ADA4896-2)
8-Lead Dual LFCSP (ADA4896-2)
8-Lead Single SOIC (ADA4897-1)
6-Lead Single SOT-23 (ADA4897-1)
10-Lead Dual MSOP (ADA4897-2)
MAXIMUM POWER DISSIPATION
The maximum safe power dissipation for the ADA4896-2/
ADA4897-1/ADA4897-2
junction temperature (T
which is the glass transition temperature, the properties of the
plastic change. Even temporarily exceeding this temperature
limit may change the stresses that the package exerts on the
die, permanently shifting the parametric performance of the
ADA4896-2/ADA4897-1/ADA4897-2. Exceeding a junction
temperature of 175C for an extended period of time can result
in changes in silicon devices, potentially causing degradation or
loss of functionality.
The power dissipated in the package (P
quiescent power dissipation and the power dissipated in the
die due to the
the output.
JA
is specified for the worst-case conditions, that is, θ
ADA4896-2/ADA4897-1/ADA4897-2
J
) on the die. At approximately 150C,
is limited by the associated rise in
JA
for the ADA4896-2/
D
Rating
11 V
See Figure 3
−V
0.7 V
−65°C to +125°C
−40°C to +125°C
300°C
150°C
θ
222
61
133
150
210
) is the sum of the
JA
S
− 0.7 V to +V
drive at
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
JA
is
S
+ 0.7 V
Rev. B | Page 8 of 28
The quiescent power dissipation is the voltage between the supply
pins (±V
RMS output voltages should be considered. If R
−V
I
case, when V
In single-supply operation with R
is V
Airflow increases heat dissipation, effectively reducing θ
Also, more metal directly in contact with the package leads
and exposed paddle from metal traces, through holes, ground,
and power planes reduces θ
Figure 3 shows the maximum safe power dissipation in the
package vs. the ambient temperature on a JEDEC standard
4-layer board. θ
ESD CAUTION
OUT
Figure 3. Maximum Power Dissipation vs. Temperature for a 4-Layer Board
S
. If the rms signal levels are indeterminate, consider the worst
, as in single-supply operation, the total drive power is V
OUT
P
P
P
D
D
D
3.5
3.0
2.5
2.0
1.5
1.0
0.5
= V
= Quiescent Power + (Total Drive Power − Load Power)
0

–45 –35 –25 –15 –5

S
) multiplied by the quiescent current (I
T
6-LEAD SOT-23


S
J
V
V
/2.
= 150°C
OUT
S
8-LEAD MSOP
S


JA
I
= V
I
S
values are approximations.
S


S

10-LEAD MSOP

/4 for R
AMBIENT TEMPERATURE (°C)





5
V
V
S
2
R
15 25 35 45 55 65 75 85 95 105 115 125
S
4 /
L
JA

L
.

2
to midsupply.
8-LEAD SOIC
V
R
8-LEAD LFCSP
OUT
L
L
referenced to −V





V
OUT
R
L
2
Data Sheet
L
S
is referenced to
).
S
, worst case
JA
.
S
×