EL5211 INTERSIL [Intersil Corporation], EL5211 Datasheet - Page 12

• Manufacturer Part Number: EL5211
• Description: 60MHz Rail-to-Rail Input-Output Op Amps
• Manufacturer: INTERSIL [Intersil Corporation]

The maximum power dissipation actually produced by an IC
is the total quiescent supply current times the total power
supply voltage, plus the power in the IC due to the loads, or:
P
when sourcing, and:
P
when sinking,
where:
• i = 1 to 2 for dual and 1 to 4 for quad
• V
• I
• V
• I
If we set the two P
can solve for R
30, and 31 provide a convenient way to see if the device will
overheat. The maximum safe power dissipation can be
found graphically, based on the package type and the
ambient temperature. By using the previous equation, it is a
simple matter to see if P
derating curves. To ensure proper operation, it is important
to observe the recommended derating curves shown in
Figures 29, 30 & 31.
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
DMAX
DMAX
FIGURE 29. PACKAGE POWER DISSIPATION vs AMBIENT
SMAX
LOAD
S
OUT
= Total supply voltage
=
=
i = Maximum output voltage of the application
i = Load current
= Maximum supply current per amplifier
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
Σi V
Σi V
0
[
[
0
JEDEC JESD51-3 LOW EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
TEMPERATURE
694mW
S
S
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
LOAD
×
×
I
I
SMAX
SMAX
DMAX
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
25
AMBIENT TEMPERATURE (°C)
i to avoid device overheat. Figures 29,
For information regarding Intersil Corporation and its products, see www.intersil.com
+
+
DMAX
equations equal to each other, we
(
(
V
V
50
θ
S
OUT
12
HTSSOP14
JA
+ V
exceeds the device's power
=144°C/W
–
i V
–
OUT
75
S
- )
i )
85
×
×
I
I
LOAD
LOAD
100
i
i
]
]
125
Unused Amplifiers
It is recommended that any unused amplifiers in a dual and
a quad package be configured as a unity gain follower. The
inverting input should be directly connected to the output
and the non-inverting input tied to the ground plane.
Power Supply Bypassing and Printed Circuit
Board Layout
The EL5111, EL5211, and EL5411 can provide gain at high
frequency. As with any high-frequency device, good printed
circuit board layout is necessary for optimum performance.
Ground plane construction is highly recommended, lead
lengths should be as short as possible and the power supply
pins must be well bypassed to reduce the risk of oscillation.
For normal single supply operation, where the V
connected to ground, a 0.1µF ceramic capacitor should be
placed from V
capacitor should then be connected in parallel, placed in the
region of the amplifier. One 4.7µF capacitor may be used for
multiple devices. This same capacitor combination should be
placed at each supply pin to ground if split supplies are to be
used.
FIGURE 30. PACKAGE POWER DISSIPATION vs AMBIENT
3.5
2.5
1.5
0.5
3
2
1
0
0
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
CONDUCTIVITY (4-LAYER) TEST BOARD -
HTSSOP EXPOSED DIEPAD SOLDERED TO
PCB PER JESD51-5
TEMPERATURE
2.632W
S
+ to pin to V
25
AMBIENT TEMPERATURE (°C)
S
50
- pin. A 4.7µF tantalum
θ
HTSSOP14
JA
=38°C/W
75
85
100
S
- pin is
125
FN7119.4