EL9211 INTERSIL [Intersil Corporation], EL9211 Datasheet - Page 7

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EL9211

Manufacturer Part Number
EL9211
Description
100MHz 100mA VCOM Amplifiers
Manufacturer
INTERSIL [Intersil Corporation]
Datasheet
Typical Performance Curves
FIGURE 19.
FIGURE 21. PACKAGE POWER DISSIPATION vs AMBIENT
FIGURE 23. PACKAGE POWER DISSIPATION vs AMBIENT
2.5
1.5
0.5
3
2
1
0
0.45
0.35
0.25
0.15
0.05
0.4
0.3
0.2
0.1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
2
0
1
0
SUPPLY CURRENT(PER AMPLIFIER) vs SUPPLY
VOLTAGE
TEMPERATURE
TEMPERATURE
0
0
JEDEC JESD51-3 LOW EFFECTIVE
THERMAL CONDUCTIVITY TEST BOARD
JEDEC JESD51-3 LOW EFFECTIVE
THERMAL CONDUCTIVITY TEST BOARD
694mW
391mW
2.5
25
25
AMBIENT TEMPERATURE (°C)
AMBIENT TEMPERATURE (°C)
3
50
50
3.5
θ
V
±I
HTSSOP14
JA
7
S
S
75
75
=144°C/W
4
(±V)
85
85
4.5
100
100
(Continued)
5
125
125
5.5
EL9211, EL9212, EL9214
150
150
6
FIGURE 20. PACKAGE POWER DISSIPATION vs AMBIENT
FIGURE 22. PACKAGE POWER DISSIPATION vs AMBIENT
0.45
0.35
0.25
0.15
0.05
0.5
0.4
0.3
0.2
0.1
3.5
2.5
1.5
0.5
0
3
2
1
0
TEMPERATURE
TEMPERATURE
0
0
JEDEC JESD51-7 HIGH EFFECTIVE
THERMAL CONDUCTIVITY TEST BOARD
JEDEC JESD51-7 HIGH EFFECTIVE
THERMAL CONDUCTIVITY TEST BOARD -
HTSSOP EXPOSED DIEPAD SOLDERED
TO PCB PER JESD51-5
435mW
2.632W
25
25
AMBIENT TEMPERATURE (°C)
AMBIENT TEMPERATURE (°C)
50
50
θ
θ
HTSSOP14
JA
JA
75
75
SOT23-5/6
=230°C/W
=38°C/W
85
85
100
100
125
125
December 22, 2004
150
150
FN7007.0

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