MAX8576 MAXIM [Maxim Integrated Products], MAX8576 Datasheet - Page 17

• Manufacturer Part Number: MAX8576
• Description: 3V to 28V Input, Low-Cost, Hysteretic Synchronous Step-Down Controllers
• Manufacturer: MAXIM [Maxim Integrated Products]

1) Place IC decoupling capacitors as close to IC pins
2) For output current > 10A, a four-layer PC board is
3) Input, output, and VL capacitors are connected to
4) Make the connection from the current-limit setting
Central Semiconductor
Panasonic
Sumida
International Rectifier
Kemet
Taiyo Yuden
TDK
Rubycon
as possible. Place the input ceramic decoupling
capacitor directly across and as close as possible to
the high-side MOSFET’s drain and the low-side
MOSFET’s source. This is to help contain the high
switching current within this small loop.
recommended. Pour a ground plane in the second
layer underneath the IC to minimize noise coupling.
the power ground plane with the exception of C12
and C22. These capacitors and all other capacitors
are connected to the analog ground plane.
resistor directly to the high-side MOSFET’s drain to
minimize the effect of PC board trace resistance
and inductance.
MANUFACTURER
______________________________________________________________________________________
TOP VIEW
3V to 28V Input, Low-Cost, Hysteretic
Synchronous Step-Down Controllers
GND
FB
SS
VL
DL
1
2
3
4
5
COMPONENT
Capacitors
Capacitors
Capacitors
Capacitors
MOSFETs
Inductors
Inductors
MAX8576
MAX8577
Diodes
Suggested External Component Manufacturers
MAX
10
9
8
7
6
OCSET
IN
DH
LX
BST
www.centralsemi.com
www.panasonic.com
www.sumida.com
www.irf.com
www.kemet.com
www.t-yuden.com
www.component.tdk.com
www.rubycon.com
GND
V
FB
SS
DL
TRANSISTOR COUNT: 2087
PROCESSS: BICMOS
5) Place the MOSFET as close as possible to the IC to
6) Connect the drain leads of the power MOSFET to a
7) Place the feedback components as close to the IC
8) Refer to the EV kit for further guidelines.
CC
1
2
3
4
5
minimize trace inductance. If parallel MOSFETs are
used, keep the gate connection to both gates
equal.
large copper area to help cool the device. Refer to
the power MOSFET data sheet for the recommend-
ed copper area.
pins as possible. The feedback divider-resistor from
FB to the output inductor should be connected
directly to the inductor and not sharing with other
connections to this node.
WEBSITE
MAX8578
MAX8579
MAX
10
9
8
7
6
OCSET
EN
DH
LX
BST
Pin Configurations
Chip Information
631-435-1110
402-564-3131
847-956-0666
800-341-0392
864-963-6300
408-573-4150
888-835-6646
408-467-3864
PHONE
17