CBTD3306GM NXP [NXP Semiconductors], CBTD3306GM Datasheet - Page 13

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CBTD3306GM

Manufacturer Part Number
CBTD3306GM
Description
Dual bus switch with level shifting Multiple package options
Manufacturer
NXP [NXP Semiconductors]
Datasheet
NXP Semiconductors
Fig 17. Package outline SOT902-1 (XQFN8U)
CBTD3306
Product Specification
XQFN8U: plastic extremely thin quad flat package; no leads;
8 terminals; UTLP based; body 1.6 x 1.6 x 0.5 mm
DIMENSIONS (mm are the original dimensions)
UNIT
mm
SOT902-1
VERSION
OUTLINE
not for soldering
metal area
max
0.5
A
terminal 1
index area
terminal 1
index area
0.05
0.00
A
L
1
1
3
2
1
0.25
0.15
b
IEC
- - -
L
1.65
1.55
D
e
1.65
1.55
E
4
8
D
0.55
MO-255
JEDEC
e
0
All information provided in this document is subject to legal disclaimers.
e
REFERENCES
0.5
e
1
Rev. 5 — 28 April 2011
0.35
0.25
L
5
6
7
B
b
0.15
0.05
JEITA
L
- - -
1
e
e
A
E
scale
1
1
1
∅ v
∅ w
0.1
v
M
M
C
C
0.05
w
A
B
0.05
y
A
2 mm
0.05
y
A
y
1
1
1
Dual bus switch with level shifting
C
PROJECTION
EUROPEAN
detail X
CBTD3306
X
C
© NXP B.V. 2011. All rights reserved.
y
ISSUE DATE
05-11-25
07-11-14
SOT902-1
13 of 17

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