CBTD3861BQ NXP [NXP Semiconductors], CBTD3861BQ Datasheet
CBTD3861BQ
Related parts for CBTD3861BQ
CBTD3861BQ Summary of contents
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... Ordering information Table 1. Ordering information Type number Package Temperature range CBTD3861PW −40 °C to +85 °C CBTD3861DK −40 °C to +85 °C CBTD3861BQ −40 °C to +85 °C [1] Also known as QSOP24 package Name Description TSSOP24 plastic thin shrink small outline package; 24 leads; body width 4.4 mm [1] SSOP24 plastic shrink small outline package ...
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NXP Semiconductors 4. Functional diagram Fig 1. Logic diagram 5. Pinning information 5.1 Pinning CBTD3861 n. A10 11 GND 12 Fig ...
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NXP Semiconductors (1) The die substrate is attached to this pad using conductive die attach material. It can not be used as supply pin or input. Fig 4. Pin configuration for DHVQFN24 (SOT815-1) 5.2 Pin description Table 2. Pin description ...
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NXP Semiconductors 7. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). − ° ° +85 C, unless otherwise specified. amb Symbol Parameter V supply voltage CC V ...
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NXP Semiconductors Table 6. Static characteristics Voltages are referenced to GND (ground = 0 V). Symbol Parameter R ON resistance ON [1] All typical values are [2] This is the increase in supply ...
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NXP Semiconductors 3.6 V pass (V) 3.2 2.8 2.4 2.0 4.4 4.8 = 100 μ ( Fig 7. Pass voltage versus ...
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NXP Semiconductors 10. Dynamic characteristics Table 7. Dynamic characteristics Voltages are referenced to GND (ground = 0 V). For test circuit see Symbol Parameter t propagation delay pd t enable time en t disable time dis [1] The propagation delay ...
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NXP Semiconductors OE input output LOW-to-OFF OFF-to-LOW output HIGH-to-OFF OFF-to-HIGH Measurement points are given in Logic levels: V and Fig 11. Enable and disable times Table 8. Measurement points Supply voltage Input ...
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NXP Semiconductors 12. Test information Test data is given in Table All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz; Z The outputs are measured one at a time with one transition per measurement. ...
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NXP Semiconductors 13. Package outline SSOP24: plastic shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635 DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) A UNIT A 1 ...
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NXP Semiconductors TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4 pin 1 index 1 DIMENSIONS (mm are the original dimensions) A UNIT max. 0.15 0.95 mm ...
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NXP Semiconductors DHVQFN24: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 24 terminals; body 3.5 x 5.5 x 0.85 mm terminal 1 index area terminal 1 index area ...
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NXP Semiconductors 14. Abbreviations Table 10. Abbreviations Acronym Description CDM Charged Device Model ESD ElectroStatic Discharge HBM Human Body Model PRR Pulse Rate Repetition TTL Transistor-Transistor Logic 15. Revision history Table 11. Revision history Document ID Release date CBTD3861 v.1 ...
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NXP Semiconductors 16. Legal information 16.1 Data sheet status [1][2] Document status Product status Objective [short] data sheet Development Preliminary [short] data sheet Qualification Product [short] data sheet Production [1] Please consult the most recently issued document before initiating or ...
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NXP Semiconductors Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 17. Contact information For more information, please visit: For sales ...
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NXP Semiconductors 18. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . ...