W25X10 WINBOND [Winbond], W25X10 Datasheet - Page 39

• Manufacturer Part Number: W25X10
• Description: 1M-BIT, 2M-BIT, 4M-BIT AND 8M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI
• Manufacturer: WINBOND [Winbond]

12.2 8-Pin SOIC 208-mil (Package Code SS)
Notes:
1. Controlling dimensions: inches, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the package.
4. Formed leads shall be planar with respect to one another within .0004 inches at the seating plane.
SYMBOL
A1
A2
E1
C
D
A
E
b
e
L
θ
y
W25X10, W25X20, W25X40, W25X80
1.75
0.05
1.70
0.35
0.19
5.18
7.70
5.18
0.50
MIN
MILLIMETERS
---
0
o
1.27 BSC
- 39 -
MAX
2.16
0.25
1.91
0.48
0.25
5.38
8.10
5.38
0.80
0.10
8
o
0.069
0.002
0.067
0.014
0.007
0.204
0.303
0.204
0.020
Publication Release Date: September 22, 2006
MIN
---
0
0.050 BSC
o
INCHES
0.085
0.010
0.075
0.019
0.010
0.212
0.319
0.212
0.031
0.004
MAX
8
o
Preliminary - Revision I