W25X10BLSNIG WINBOND [Winbond], W25X10BLSNIG Datasheet - Page 47

• Manufacturer Part Number: W25X10BLSNIG
• Description: 1M-BIT, 2M-BIT AND 4M-BIT 2.5V SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL I/O SPI
• Manufacturer: WINBOND [Winbond]

11.2 8-Pin SOIC 208-mil (Package Code SS)
Notes:
1. Controlling dimensions: millimeters, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D1 and E1 do not include mold flash protrusions and should be measured from the bottom of the package.
4. Formed leads coplanarity with respect to seating plane shall be within 0.004 inches
SYMBOL
D1
A1
A2
E1
A
C
D
H
b
E
e
L
y
θ
MIN
1.75
0.05
1.70
0.35
0.19
5.18
5.13
5.18
5.13
7.70
0.50
0°
-
MILLIMETERS
1.27 BSC
NOM
1.95
0.15
1.80
0.42
0.20
5.28
5.23
5.28
5.23
7.90
0.65
-
-
0.010
MAX
2.16
0.25
1.91
0.48
0.25
5.38
5.33
5.38
5.33
8.10
0.80
8°
- 47 -
0.069
0.002
0.067
0.014
0.007
0.204
0.202
0.204
0.202
0.303
0.020
MIN
W25X10BL/20BL/40BL
0°
-
Publication Release Date: October 14, 2009
0.050 BSC
INCHES
.
NOM
0.077
0.006
0.071
0.017
0.008
0.208
0.206
0.208
0.206
0.311
0.026
-
-
Preliminary -- Revision A
0.085
0.010
0.075
0.019
0.010
0.212
0.210
0.212
0.210
0.319
0.031
0.004
MAX
8°