HM6-6642-9 INTERSIL [Intersil Corporation], HM6-6642-9 Datasheet - Page 6

• Manufacturer Part Number: HM6-6642-9
• Description: 512 x 8 CMOS PROM
• Manufacturer: INTERSIL [Intersil Corporation]

Absolute Maximum Ratings
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +7.0V
Input, Output or I/O Voltage . . . . . . . . . . . GND -0.3V to V
Typical Derating Factor . . . . . . . . . . . . 5mA/MHz Increase in ICCOP
ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 1
Operating Conditions
Operating Voltage Range . . . . . . . . . . . . . . . . . . . . . +4.5V to +5.5V
Operating Temperature Range
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
DC Electrical Specifications
AC Electrical Specifications
(10) TELAX
SYMBOL
HM-6642B-9, HM-6642-9 . . . . . . . . . . . . . . . . . . . -40
(1) TELQV
(2) TAVQV
(3) TGVQV
(4) TGVQX
(5) TGXQZ
(6) TELEH
(7) TELEL
(8) TEHEL
(9) TAVEL
ICCOP
ICCSB
VOH1
VOH2
SYMBOL
VOL
IOZ
VIH
VIL
II
Standby Supply Current
Operating Supply Current (Note 3)
Input Leakage Current
Output Leakage Current
Input Low Voltage
Input High Voltage
Output Low Voltage
Output High Voltage
Output High Voltage (Note 2)
Chip Enable Access Time
Address Access Time
(TAVQV = TELQV + TAVEL)
Output Enable Access Time
Output Enable Time
Output Disable Time
Chip Enable Pulse Negative Width
Read Cycle Time
Chip Enable Pulse Positive Width
Address Setup Time
Address Hold Time
PARAMETER
PARAMETER
V
CC
= 5V
VCC - 1.0
10%; T
o
MIN
-1.0
-1.0
-0.3
2.4
2.4
C to +85
-
-
-
CC
LIMITS
A
+0.3V
HM-6642
= -40
MIN
120
160
HM-6642B-9
40
20
25
o
5
-
-
-
-
VCC + 0.3
C
6-6
o
MAX
+1.0
+1.0
C to +85
100
0.8
0.4
20
-
-
Thermal Information
Thermal Resistance
Maximum Storage Temperature Range . . . . . . . . .-65
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . +175
Maximum Lead Temperature (Soldering 10s)+300
Die Characteristics
Gate Count . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1680 Gates
SBDIP Package . . . . . . . . . . . . . . . . . .
Slim SBDIP . . . . . . . . . . . . . . . . . . . . .
CLCC Package . . . . . . . . . . . . . . . . . .
MAX
120
140
50
50
50
-
-
-
-
-
o
LIMITS
C (HM-6642B-9, HM-6642-9)
UNITS
mA
V
V
V
V
V
A
A
A
MIN
200
350
150
20
60
5
HM-6642-9
-
-
-
-
IO = 0, VI = VCC or GND, VCC = 5.5V
f = 1MHz, IO = 0, VI = VCC or GND, VCC = 5.5V
GND
GND
VCC = 4.5V
VCC = 5.5V
IOL = 3.2mA, VCC = 4.5V
IOH = -1.0mA, VCC = 4.5V
IOH = -100 A, VCC = 4.5V
MAX
200
220
150
150
150
-
-
-
-
-
VI
VO
VCC, VCC = 5.5V
VCC, VCC = 5.5V
TEST CONDITIONS
UNITS
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
52
70
58
o
o
o
JA
C/W
C/W
C/W
CONDITIONS
Notes 1, 4
Notes 1, 4
Notes 1, 4
Notes 2, 4
Notes 2, 4
Notes 1, 4
Notes 1, 4
Notes 1, 4
Notes 1, 4
Notes 1, 4
o
C
TEST
o
C to +150
14
19
14
o
o
o
JC
C/W
C/W
C/W
o
o
C
C