STM8L151G4Y3 STMICROELECTRONICS [STMicroelectronics], STM8L151G4Y3 Datasheet - Page 115

• Manufacturer Part Number: STM8L151G4Y3
• Description: 8-bit ultralow power MCU, up to 32 KB Flash, 1 KB Data EEPROM RTC, LCD, timers, USART, I2C, SPI, ADC, DAC, comparators
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

1. Drawing is not to scale.
2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life.
3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and solder this back-
4. Dimensions are in millimeters.
STM8L151xx, STM8L152xx
Table 62.
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Figure 45. UFQFPN32 - 32-lead ultra thin fine pitch
side pad to PCB ground.
Dim.
ddd
D2
A1
A3
E2
A
D
E
N
b
e
L
Seating plane
Pin # 1 ID
R = 0.30
C
E2
A3
UFQFPN32 - 32-lead ultra thin fine pitch quad flat no-lead package (5 x 5),
quad flat no-lead package outline
(5 x 5)
package mechanical data
b
8
1
32
9
0.00
0.18
4.90
4.90
3.40
0.30
Min
0.5
(1)(2)(3)
e
Bottom view
D2
D
16
0.152
0.500
L
0.55
0.02
0.23
5.00
3.50
5.00
3.50
0.40
0.08
mm
Typ
17
24
L
A1
E
A
Doc ID 15962 Rev 5
ddd C
A0B8_ME
Max
0.05
0.28
5.10
5.10
3.60
0.50
0.6
Number of pins
32
Figure 46. UFQFPN32 recommended
0.0197
0.0071
0.1929
0.1929
0.1339
0.0118
Min
0
footprint
inches
0.0217
0.0008
0.0091
0.1969
0.1378
0.1969
0.1378
0.0197
0.0157
0.0031
Package characteristics
0.006
Typ
(1)(4)
(1)
0.0110
0.0236
0.0020
0.2008
0.2008
0.1417
0.0197
Max
115/122