STM8L151G4Y3 STMICROELECTRONICS [STMicroelectronics], STM8L151G4Y3 Datasheet - Page 117

• Manufacturer Part Number: STM8L151G4Y3
• Description: 8-bit ultralow power MCU, up to 32 KB Flash, 1 KB Data EEPROM RTC, LCD, timers, USART, I2C, SPI, ADC, DAC, comparators
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

STM8L151xx, STM8L152xx
1. Drawing is not to scale.
2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life.
3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and solder this
Figure 48. UFQFPN48 7 x 7 mm, 0.5 mm pitch, package
back-side pad to PCB ground.
Table 64.
1. Values in inches are converted from mm and rounded to 4 decimal digits.
A
A1
D
E
L
T
b
e
outline
Symbol
(1)(2)(3)
UFQFPN48 – ultra thin fine pitch quad flat pack no-lead 7 × 7 mm, 0.5 mm
pitch package mechanical data
0.500
0.000
6.900
6.900
0.300
0.200
Typ
millimeters
0.550
7.000
7.000
0.400
0.152
0.250
0.500
Doc ID 15962 Rev 5
0.020
Min
0.600
0.050
7.100
7.100
0.500
0.300
Max
Figure 49. Recommended footprint
7.30
0.30
0.55
0.0197
0.0000
0.2717
0.2717
0.0118
0.0079
0.20
Typ
12
1
48
13
(dimensions in mm)
6.20
Package characteristics
inches
0.0217
0.2756
0.2756
0.0157
0.0060
0.0098
0.0197
7.30
5.60
5.80
0.0008
6.20
Min
(1)
5.60
0.50
37
24
36
25
0.0236
0.0020
0.2795
0.2795
0.0197
0.0118
0.75
Max
(1)
117/122
5.80
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