TPS850_07 TOSHIBA [Toshiba Semiconductor], TPS850_07 Datasheet - Page 5

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TPS850_07

Manufacturer Part Number
TPS850_07
Description
Photo-IC Silicon Epitaxial Planar
Manufacturer
TOSHIBA [Toshiba Semiconductor]
Datasheet
Packing Specification
(2)
(3)
(1)
(2)
Recommended soldering pattern
Cleaning conditions
Packing quantity
Packing format
When cleaning is required after soldering
An aluminum envelope containing silica gel and reels is deaerated and sealed.
Pack shock-absorbent materials around the aluminum envelopes in the cartons to cushion them.
Carton specification
Chemicals: AK225 alcohol
Temperature and time: 50°C × 30 s or : 30°C × 3 minutes
Ultrasonic cleaning: 300 W or less
Carton dimensions
Reel (minimum packing quantity)
(W) 81 mm × (L) 280 mm × (H) 280 mm
Carton
1.6
1.3
5
5 reels (15000 devices)
Label
1.6
3000 devices
Unit: mm
2007-10-01
TPS850

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