SE98 NXP [NXP Semiconductors], SE98 Datasheet - Page 26

• Manufacturer Part Number: SE98
• Description: DDR memory module temp sensor, 3.3 V
• Manufacturer: NXP [NXP Semiconductors]

NXP Semiconductors
10. Limiting values
SE98_4
Product data sheet
9.2 Layout consideration
9.3 Thermal considerations
The SE98 does not require any additional components other than the host controller to
measure temperature. A 0.1 F bypass capacitor between the V
located as close as possible to the power and ground pins for noise protection.
In general, self-heating is the result of power consumption and not a concern, especially
with the SE98, which consumes very low power. In the event the SDA and EVENT pins
are heavily loaded with small pull-up resistor values, self-heating affects temperature
accuracy by approximately 0.5 C.
Equation 1
where:
Table 24.
In accordance with the Absolute Maximum Rating System (IEC 60134).
[1]
T
Symbol
V
V
V
I
V
T
T
sink
j(max)
stg
DD
n
A0
esd
T = T
T
T
R
V
V
I
I
OL1
OL2
j
amb
OL1
OL2
th(j-a)
In general, application of 10 V on the A0 pin would not damage the pin, but NXP Semiconductors does not
guarantee the overvoltage for this pin.
=
= junction temperature
= SDA output current LOW
= EVENT output current LOW.
R
= ambient temperature
= SDA output low voltage
= EVENT output low voltage
th j-a
= package thermal resistance
j
Parameter
supply voltage
voltage on any other pin
voltage on pin A0
sink current
electrostatic discharge
voltage
maximum junction
temperature
storage temperature
Limiting values
is the formula to calculate the effect of self-heating:
T
amb
V
DD
Rev. 04 — 2 February 2009
I
DD
+
V
OL1
Conditions
SDA, SCL, EVENT pins
overvoltage input; A0 pin
at SDA, SCL, EVENT pins
HBM
MM
CDM
I
OL1
+
DDR memory module temp sensor, 3.3 V
V
OL2
I
OL2
[1]
DD
Min
-
-
-
-
0.3
0.3
0.3
1
65
and V
© NXP B.V. 2009. All rights reserved.
SS
Max
+4.2
+4.2
+10
+50.0
2500
250
1000
150
+165
pins is
SE98
26 of 39
Unit
V
V
V
mA
V
V
V
C
C
(1)