LM95233_07 NSC [National Semiconductor], LM95233_07 Datasheet - Page 8
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LM95233_07
Manufacturer Part Number
LM95233_07
Description
Dual Remote Diode and Local Temperature Sensor with SMBus Interface and TruTherm Technology
Manufacturer
NSC [National Semiconductor]
Datasheet
1.LM95233_07.pdf
(36 pages)
www.national.com
Note 3: Reflow temperature profiles are different for packages containing lead (Pb) than for those that do not.
Note 4: Human body model, 100 pF discharged through a 1.5 kΩ resistor. Machine model, 200 pF discharged directly into each pin. Charged Device Model
(CDM) simulates a pin slowly acquiring charge (such as from a device sliding down the feeder in an automated assembler) then rapidly being discharged.
Note 5: Thermal resistance junction-to-ambient when attached to a 4 layer printed circuit board per JEDEC standard JESD51-7:
Note, all quoted values include +15% error factor from nominal value.
Note 6: Typicals are at T
Note 7: Limits are guaranteed to National's AOQL (Average Outgoing Quality Level).
Note 8: Local temperature accuracy does not include the effects of self-heating. The rise in temperature due to self-heating is the product of the internal power
dissipation of the LM95233 and the thermal resistance. See
Note 9: The accuracy of the LM95233CISD is guaranteed when using a typical thermal diode of an Intel processor on a 65 nm process or an MMBT3904 diode-
connected transistor, as selected in the Remote Diode Model Select register. See typical performance curve for performance with Intel processor on a 90 nm
process. For further information on other thermal diodes see applications Section 3.1 "Diode Non-ideality" or send email to hardware.monitor.team@national.com.
Note 10: Quiescent current will not increase substantially with an SMBus communication.
Note 11: This specification is provided only to indicate how often temperature data is updated. The LM95233 can be read at any time without regard to conversion
state (and will yield last conversion result).
Note 12: The output rise time is measured from (V
Note 13: The output fall time is measured from (V
Note 14: Holding the SMBDAT and/or SMBCLK lines Low for a time interval greater than t
SMBDAT and SMBCLK pins to a high impedance state.
Pin #
10
11
12
13
14
1
2
3
4
5
6
7
8
9
– 14-lead LLP = 90°C/W (no thermal vias, no airflow)
– 14-lead LLP = 63°C/W (1 thermal via, no airflow)
– 14-lead LLP = 43°C/W (6 thermal vias, no airflow)
– 14-lead LLP = 31°C/W (6 thermal vias, 900 ln. ft. / min. airflow)
SMBDAT
SMBCLK
TCRIT1
TCRIT2
TCRIT2
A
Label
GND
D2+
D1+
= 25°C and represent most likely parametric norm.
V
NC
NC
NC
A0
D-
DD
Circuit
A
A
A
A
B
B
B
B
B
B
–
–
–
–
IN(1)
IN(0)
min + 0.15V) to (V
max − 0.15V) to (V
(Note 5)
for the thermal resistance to be used in the self-heating calculation.
IN(0)
IN(1)
max − 0.15V).
min + 0.15V).
8
Circuits for Pin ESD Protection Structure
TIMEOUT
will reset the LM95233's SMBus state machine, therefore setting
Circuit A
Circuit B