TMP47C101MG TOSHIBA [Toshiba Semiconductor], TMP47C101MG Datasheet - Page 3

• Manufacturer Part Number: TMP47C101MG
• Description: Document Change Notification
• Manufacturer: TOSHIBA [Toshiba Semiconductor]

Previous Part Number
1. Part number
2. Package code and dimensions
3. Addition of notes on lead solderability
Lead solderability of Pb-free devices (with the G suffix)
(in Body Text)
*
TMP47C101M
TMP47C201M
TMP47C101P
TMP47C201P
: For the dimensions of the new package, see the attached Package Dimensions diagram.
Solderability
The following solderability test is conducted on the new device.
Test
(1) Use of Lead (Pb)
(2) Use of Lead (Pb)-Free
Previous Package Code
·use of R-type flux
·solder bath temperature = 245°C
·dipping time = 5 seconds
·the number of times = once
·use of R-type flux
·solder bath temperature = 230°C
·dipping time = 5 seconds
·the number of times = once
P-DIP16-300-2.54A
P-DIP16-300-2.54A
P-SOP16-300-1.27
P-SOP16-300-1.27
(in Body Text)
Test Conditions
New Part Number
II
TMP47C101MG
TMP47C201MG
TMP47C101PG
TMP47C201PG
Leads with over 95% solder coverage
New Package Code
till lead forming are acceptable.
DIP16-P-300-2.54A
DIP16-P-300-2.54A
SOP16-P-300-1.27
SOP16-P-300-1.27
Remark
TMP47C101/201
TMP47P201VPG
TMP47P201VPG
2008-03-06
OTP
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