PIP202-12M-2 NXP [NXP Semiconductors], PIP202-12M-2 Datasheet - Page 12
![no-image](/images/no-image-200.jpg)
PIP202-12M-2
Manufacturer Part Number
PIP202-12M-2
Description
DC-to-DC converter powertrain
Manufacturer
NXP [NXP Semiconductors]
Datasheet
1.PIP202-12M-2.pdf
(20 pages)
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIP202-12M-2
Manufacturer:
INFINEON
Quantity:
2 670
Part Number:
PIP202-12M-2
Manufacturer:
NXP/恩智浦
Quantity:
20 000
Philips Semiconductors
9397 750 11943
Product data
thermal resistance of this package, the printed-circuit board must be designed so that
heat is conducted away efficiently from the package. This can be achieved by
maximizing the area of copper around each pad, and by incorporating thermal vias to
conduct the heat to inner and/or bottom layers of the printed-circuit board.
An example of a thermal via pattern is shown in
with no forced air cooling, the use of thermal vias typically reduces the thermal
resistance from 25 K/W to 20 K/W. The additional use of a small fan can reduce this
further to approximately 15 K/W.
The thermal resistance of a particular design can be measured by passing a known
current between V
through the source-drain diode of the upper MOSFET. The direction of current flow is
into V
and used to calculate the power dissipation in the PIP202-12M. The case
temperature of the PIP202-12M can be measured using an infra-red thermometer.
The thermal resistance can then be calculated using the following equation:
where T
temperature ( C), I is the MOSFET current (A), and V
V
Where more than one phase is used, for example the circuit of
resistance of each PIP202-12M should be measured with current flowing in all
phases.
R
Fig 13. Printed-circuit board thermal via pattern.
SSO
th j
–
All holes 0.5 mm diameter with 1 mm spacing.
SSO
and V
pcb
case
and out of V
=
DDO
is the measured case temperature ( C), T
T
------------------------------ - K W
case
(V).
I
Rev. 02 — 24 November 2003
SSO
–
V
T
F
DDO
amb
and V
. The volt drop between V
DDO
. The current flows through the Schottky diode and
PAD1
PAD2
PAD3
Figure
03ag36
DC-to-DC converter powertrain
SSO
F
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
amb
is the voltage drop between
13. In a typical application,
PIP202-12M-2
and V
is the ambient
DDO
Figure
is then measured
11, the thermal
12 of 20
(3)