HCS190DMSR INTERSIL [Intersil Corporation], HCS190DMSR Datasheet
![no-image](/images/no-image-200.jpg)
HCS190DMSR
Related parts for HCS190DMSR
HCS190DMSR Summary of contents
Page 1
... CMOS/SOS Logic Family. The HCS190MS is supplied lead Ceramic flatpack (K suffi SBDIP Package (D suffix). Ordering Information PART NUMBER TEMPERATURE RANGE HCS190DMSR HCS190KMSR HCS190D/Sample HCS190K/Sample HCS190HMSR CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. ...
Page 2
Absolute Maximum Ratings Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +7.0V Input Voltage ...
Page 3
TABLE 2. AC ELECTRICAL PERFORMANCE CHARACTERISTICS PARAMETER SYMBOL Propagation Delay TPLH VCC = 4.5V, VIH = 4.5V, VIL = TPHL VCC = 4.5V, VIH = 4.5V, VIL = TPLH VCC = 4.5V, ...
Page 4
TABLE 3. ELECTRICAL PERFORMANCE CHARACTERISTICS PARAMETER SYMBOL Capacitance Power CPD VCC = 5.0V, VIH = 5.0V, Dissipation VIL = 0V 1MHz Input Capacitance CIN VCC = 5.0V, VIH = 5.0V, VIL = 0V 1MHz Setup Time ...
Page 5
TABLE 4. POST IRRADIATION ELECTRICAL PERFORMANCE CHARACTERISTICS (Continued) PARAMETER SYMBOL Output Voltage High VOH VCC = 5.5V, VIH = 3.85V, VIL = 1.65V, IOH = -50 A VCC = 4.5V, VIH = 3.15V, VIL = 1.35V, IOH = -50 A ...
Page 6
CONFORMANCE GROUPS Initial Test (Preburn-In) Interim Test I (Postburn-In) Interim Test II (Postburn-In) PDA Interim Test III (Postburn-In) PDA Final Test Group A (Note 1) Group B Subgroup B-5 Subgroup B-6 Group D NOTE: 1. Alternate group A testing in ...
Page 7
Intersil Space Level Product Flow - ‘MS’ Wafer Lot Acceptance (All Lots) Method 5007 (Includes SEM) GAMMA Radiation Verification (Each Wafer) Method 1019, 4 Samples/Wafer, 0 Rejects 100% Nondestructive Bond Pull, Method 2023 Sample - Wire Bond Pull Monitor, Method ...
Page 8
Propagation Delay Timing Diagram VIH INPUT VS VSS TPLH VOH VS OUTPUT VOL Transition Timing Diagram TTLH VOH 80% 20% OUTPUT VOL VOLTAGE LEVELS PARAMETER HCS VCC 4.50 VIH 4.50 VS 2.25 VIL 0 GND 0 Pulse Width, Setup, Hold ...
Page 9
Die Characteristics DIE DIMENSIONS: 104 x 86 (mils) 2.65 x 2.19 (mm) METALLIZATION: Type Å Å Thickness: 11k 1k GLASSIVATION: Type: SiO 2 Å Å Thickness: 13k 2.6k WORST CASE CURRENT DENSITY <2 ...