LPC2212FBD144/00 NXP [NXP Semiconductors], LPC2212FBD144/00 Datasheet

LPC2212FBD144/00

Manufacturer Part Number

LPC2212FBD144/00

Description

16/32-bit ARM microcontrollers; 128/256 kB ISP/IAP flash with 10-bit ADC and external memory interface

Manufacturer

NXP [NXP Semiconductors]

Datasheet

1.LPC2212FBD14400.pdf (45 pages)

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1. General description

2. Features

2.1 Key features brought by LPC2212/2214/01 devices

2.2 Key features common for all devices

The LPC2212/2214 are based on a 16/32-bit ARM7TDMI-S CPU with real-time emulation

and embedded trace support, together with 128/256 kB of embedded high-speed ﬂash

memory. A 128-bit wide memory interface and a unique accelerator architecture enable

32-bit code execution at maximum clock rate. For critical code size applications, the

alternative 16-bit Thumb mode reduces code by more than 30 % with minimal

performance penalty.

With their 144-pin package, low power consumption, various 32-bit timers, 8-channel

10-bit ADC, PWM channels and up to nine external interrupt pins these microcontrollers

are particularly suitable for industrial control, medical systems, access control and

point-of-sale. Number of available fast GPIOs ranges from up to 76 pins (with external

memory) through up to 112 pins (single-chip). With a wide range of serial communications

interfaces, they are also very well suited for communication gateways, protocol converters

and embedded soft modems as well as many other general-purpose applications.

Remark: Throughout the data sheet, the term LPC2212/2214 will apply to devices with

and without the /00 or /01 sufﬁxes. The /00 or the /01 sufﬁx will be used to differentiate

from other devices only when necessary.

LPC2212/2214

16/32-bit ARM microcontrollers; 128/256 kB ISP/IAP ﬂash with

10-bit ADC and external memory interface

Rev. 04 — 3 January 2008

Fast GPIO ports enable port pin toggling up to 3.5 times faster than the original device.

They also allow for a port pin to be read at any time regardless of its function.

Dedicated result registers for ADC(s) reduce interrupt overhead. The ADC pads are

5 V tolerant when conﬁgured for digital I/O function(s).

UART0/1 include fractional baud rate generator, auto-bauding capabilities and

handshake ﬂow-control fully implemented in hardware.

Buffered SSP serial controller supporting SPI, 4-wire SSI, and Microwire formats.

SPI programmable data length and master mode enhancement.

Diversiﬁed Code Read Protection (CRP) enables different security levels to be

implemented. This feature is available in LPC2212/2214/00 devices as well.

General purpose timers can operate as external event counters.

16/32-bit ARM7TDMI-S microcontroller in a LQFP144 package.

Product data sheet

Related parts for LPC2212FBD144/00

LPC2212FBD144/00 Summary of contents

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LPC2212/2214 16/32-bit ARM microcontrollers; 128/256 kB ISP/IAP ﬂash with 10-bit ADC and external memory interface Rev. 04 — 3 January 2008 1. General description The LPC2212/2214 are based on a 16/32-bit ARM7TDMI-S CPU with real-time emulation and embedded trace support, ...

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... Individual enable/disable of peripheral functions for power optimization. I Dual power supply: N CPU operating voltage range of 1. 1. I/O power supply range of 3 3 Ordering information Table 1. Type number LPC2212FBD144 LPC2212FBD144/00 LPC2212FBD144/01 LPC2214FBD144 LPC2214FBD144/00 LPC2214FBD144/01 LPC2212_2214_4 Product data sheet Ordering information Package Name Description LQFP144 plastic low proﬁ ...

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... NXP Semiconductors 3.1 Ordering options Table 2. Type number LPC2212FBD144 LPC2212FBD144/00 LPC2212FBD144/01 LPC2214FBD144 LPC2214FBD144/00 LPC2214FBD144/01 LPC2212_2214_4 Product data sheet Ordering options Flash memory 128 kB 128 kB 128 kB 256 kB 256 kB 256 kB Rev. 04 — 3 January 2008 LPC2212/2214 16/32-bit ARM microcontrollers RAM Fast GPIO/ Temperature range SSP/ ...

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NXP Semiconductors 4. Block diagram LPC2212 LPC2214 HIGH-SPEED (3) P0, P1 GPI/O 48 PINS TOTAL ARM7 LOCAL BUS INTERNAL SRAM CONTROLLER 16 kB SRAM EXTERNAL (1) EINT[3:0] INTERRUPTS (1) 4 CAP0 CAPTURE/ (1) 4 CAP1 COMPARE (1) 4 MAT0 TIMER ...

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NXP Semiconductors 5. Pinning information 5.1 Pinning (1) Pin conﬁguration is identical for devices with and without /00 and /01 sufﬁxes. Fig 2. Pin conﬁguration (LQFP144) LPC2212_2214_4 Product data sheet 1 LPC2212 (1) LPC2214 36 Rev. 04 — 3 January ...

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NXP Semiconductors 5.2 Pin description Table 3. Pin description Symbol Pin P0[0] to P0[31] P0[0]/TXD0/PWM1 42 P0[1]/RXD0/PWM3/ 49 EINT0 P0[2]/SCL/CAP0[0] 50 P0[3]/SDA/MAT0[0]/ 58 EINT1 P0[4]/SCK0/CAP0[1] 59 P0[5]/MISO0/MAT0[1] 61 P0[6]/MOSI0/CAP0[2] 68 P0[7]/SSEL0/PWM2/ 69 EINT2 P0[8]/TXD1/PWM4 75 P0[9]/RXD1/PWM6/ 76 EINT3 P0[10]/RTS1/CAP1[0] 78 ...

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NXP Semiconductors Table 3. Pin description …continued Symbol Pin P0[14]/DCD1/EINT1 92 P0[15]/RI1/EINT2 99 P0[16]/EINT0/MAT0[2]/ 100 CAP0[2] P0[17]/CAP1[2]/SCK1/ 101 MAT1[2] P0[18]/CAP1[3]/MISO1/ 121 MAT1[3] P0[19]/MAT1[2]/MOSI1/ 122 CAP1[2] P0[20]/MAT1[3]/SSEL1/ 123 EINT3 P0[21]/PWM5/CAP1[3] 4 P0[22]/CAP0[0]/MAT0[0] 5 P0[23] 6 P0[24] 8 P0[25] 21 P0[27]/AIN0/CAP0[1]/ 23 ...

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NXP Semiconductors Table 3. Pin description …continued Symbol Pin P0[30]/AIN3/EINT3/ 33 CAP0[0] P1[0] to P1[31] P1[0]/CS0 91 P1[1]/OE 90 P1[16]/TRACEPKT0 34 P1[17]/TRACEPKT1 24 P1[18]/TRACEPKT2 15 P1[19]/TRACEPKT3 7 P1[20]/TRACESYNC 102 P1[21]/PIPESTAT0 95 P1[22]/PIPESTAT1 86 P1[23]/PIPESTAT2 82 P1[24]/TRACECLK 70 P1[25]/EXTIN0 60 P1[26]/RTCK ...

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NXP Semiconductors Table 3. Pin description …continued Symbol Pin P2[7]/D7 116 P2[8]/D8 117 P2[9]/D9 118 P2[10]/D10 120 P2[11]/D11 124 P2[12]/D12 125 P2[13]/D13 127 P2[14]/D14 129 P2[15]/D15 130 P2[16]/D16 131 P2[17]/D17 132 P2[18]/D18 133 P2[19]/D19 134 P2[20]/D20 136 P2[21]/D21 137 P2[22]/D22 ...

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NXP Semiconductors Table 3. Pin description …continued Symbol Pin P3[3]/A3 81 P3[4]/A4 80 P3[5]/A5 74 P3[6]/A6 73 P3[7]/A7 72 P3[8]/A8 71 P3[9]/A9 66 P3[10]/A10 65 P3[11]/A11 64 P3[12]/A12 63 P3[13]/A13 62 P3[14]/A14 56 P3[15]/A15 55 P3[16]/A16 53 P3[17]/A17 48 P3[18]/A18 ...

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NXP Semiconductors Table 3. Pin description …continued Symbol Pin 26, SS 38, 54, 67, 79, 93, 103, 107, 111, 128 V 139 SSA V 138 SSA(PLL) V 37, 110 DD(1V8) V 143 DDA(1V8 31, 39, ...

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NXP Semiconductors 6. Functional description Details of the LPC2212/2214 systems and peripheral functions are described in the following sections. 6.1 Architectural overview The ARM7TDMI general purpose 32-bit microprocessor, which offers high performance and very low power consumption. The ...

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NXP Semiconductors time (no matter whether the CRP off). Removal of CRP is achieved by erasure of full on-chip user ﬂash. With the CRP off, full access to the chip via the JTAG and/or ISP is restored. ...

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NXP Semiconductors Fig 3. LPC2212/2214 memory map 6.5 Interrupt controller The Vectored Interrupt Controller (VIC) accepts all of the interrupt request inputs and categorizes them as Fast Interrupt reQuest (FIQ), vectored Interrupt Request (IRQ), and non-vectored IRQ as deﬁned by ...

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NXP Semiconductors Vectored IRQs have the middle priority. Sixteen of the interrupt requests can be assigned to this category. Any of the interrupt requests can be assigned to any of the 16 vectored IRQ slots, among which slot 0 has ...

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NXP Semiconductors [1] SSP interface available on LPC2212/01 and LPC2214/01 only. 6.6 Pin connect block The pin connect block allows selected pins of the microcontroller to have more than one function. Conﬁguration registers control the multiplexers to allow connection between ...

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NXP Semiconductors 6.9 10-bit ADC The LPC2212/2214 each contain a single 10-bit successive approximation ADC with four multiplexed channels. 6.9.1 Features • Measurement range • Capable of performing more than 400000 10-bit samples per ...

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NXP Semiconductors 2 6.11 I C-bus serial I/O controller 2 The I C-bus is a bidirectional bus for inter-IC control using only two wires: a serial clock line (SCL), and a serial data line (SDA). Each device is recognized by ...

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NXP Semiconductors • When the SPI interface is used in Master mode, the SSEL pin is not needed (can be used for a different function). 6.13 SSP controller (LPC2212/2214/01 only) The SSP is a controller capable of operation on a ...

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NXP Semiconductors – Toggle on match. – Do nothing on match. 6.14.2 Features available in LPC2212/2214/01 only The LPC2212/2214/01 can count external events on one of the capture inputs if the external pulse lasts at least one half of the ...

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NXP Semiconductors • Provides Seconds, Minutes, Hours, Day of Month, Month, Year, Day of Week, and Day of Year. • Programmable reference clock divider allows adjustment of the RTC to match various crystal frequencies. 6.17 Pulse width modulator The PWM ...

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NXP Semiconductors • Pulse period and width can be any number of timer counts. This allows complete ﬂexibility in the trade-off between resolution and repetition rate. All PWM outputs will occur at the same repetition rate. • Double edge controlled ...

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NXP Semiconductors functions are turned off for any reason. Since the oscillator and other functions are turned off during Power-down mode, any wake-up of the processor from Power-down mode makes use of the Wake-up Timer. The Wake-up Timer monitors the ...

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NXP Semiconductors 6.18.6 Memory mapping control The Memory Mapping Control alters the mapping of the interrupt vectors that appear beginning at address 0x0000 0000. Vectors may be mapped to the bottom of the on-chip ﬂash memory the on-chip ...

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NXP Semiconductors The ARM core has a Debug Communication Channel function built-in. The debug communication channel allows a program running on the target to communicate with the host debugger or another separate host without stopping the program ﬂow or even ...

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NXP Semiconductors 7. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V supply voltage (1.8 V) DD(1V8) V supply voltage (3.3 V) DD(3V3) V analog supply voltage (3.3 V) DDA(3V3) ...

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NXP Semiconductors 8. Static characteristics Table 6. Static characteristics +85 C for industrial applications, unless otherwise speciﬁed. amb Symbol Parameter V supply voltage (1.8 V) DD(1V8) V supply voltage (3.3 V) DD(3V3) V analog supply ...

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NXP Semiconductors Table 6. Static characteristics +85 C for industrial applications, unless otherwise speciﬁed. amb Symbol Parameter Power consumption LPC2212/01 and LPC2214/01 I active mode supply current DD(act) I Idle mode supply current DD(idle) I ...

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NXP Semiconductors Table 7. ADC static characteristics 3.6 V unless otherwise speciﬁed; T DDA 4.5 MHz. Symbol Parameter V analog input voltage IA C analog input ia capacitance E differential linearity D error E integral ...

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NXP Semiconductors 1023 1022 1021 1020 1019 1018 7 code out offset error E O (1) Example of an actual transfer curve. (2) The ideal transfer curve. (3) Differential linearity ...

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NXP Semiconductors 8.1 Power consumption measurements for LPC2212/01 and LPC2214/01 The power consumption measurements represent typical values for the given conditions. The peripherals were enabled through the PCONP register, but for these measurements, the peripherals were not conﬁgured to run. ...

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NXP Semiconductors 45 I DD(act) (mA 1.65 Test conditions: Active mode entered executing code from on-chip ﬂash; PCLK = Temp = 25 C; core voltage 1.8 V; all peripherals disabled. Fig 7. Typical LPC2212/01 and LPC2214/01 ...

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NXP Semiconductors 8 I DD(idle) (mA 1.65 Test conditions: Idle mode entered executing code from on-chip ﬂash; PCLK = core voltage 1.8 V; all peripherals enabled. amb Fig 9. Typical LPC2212/01 and ...

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NXP Semiconductors 45 I DD(act) (mA -40 -15 Test conditions: Active mode entered executing code from on-chip ﬂash; PCLK = core voltage 1.8 V; all peripherals disabled. Fig 11. Typical LPC2212/01 and LPC2214/01 I 6.0 I ...

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NXP Semiconductors 200 I DD(pd 160 120 -40 -15 Test conditions: Power-down mode entered executing code from on-chip ﬂash. Fig 13. Typical LPC2212/01 and LPC2214/01 core power-down current I Table 8. Core voltage 1.8 V; ...

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NXP Semiconductors 9. Dynamic characteristics Table 9. Dynamic characteristics +85 C for industrial applications; V amb Symbol Parameter External clock f oscillator frequency osc T clock cycle time cy(clk) t clock HIGH time CHCX t ...

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NXP Semiconductors Table 10. External memory interface dynamic characteristics pF amb Symbol Parameter Common to read and write cycles t XCLK HIGH to address valid CHAV time t XCLK HIGH to CS ...

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NXP Semiconductors Table 10. External memory interface dynamic characteristics pF amb Symbol Parameter t BLS HIGH to data invalid BLSHDNV time t XCLK HIGH to data valid CHDV time t XCLK HIGH ...

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NXP Semiconductors 9.1 Timing XCLK CS addr data t CSLOEL OE Fig 14. External memory read access XCLK CS BLS/WE addr data OE Fig 15. External memory write access LPC2212_2214_4 Product data sheet t CSLAV OELAV t ...

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NXP Semiconductors V Fig 16. External clock timing LPC2212_2214_4 Product data sheet 0 0.2V 0 0. CHCL Rev. 04 — 3 January 2008 LPC2212/2214 16/32-bit ...

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NXP Semiconductors 10. Package outline LQFP144: plastic low profile quad flat package; 144 leads; body 1 108 109 pin 1 index 144 DIMENSIONS (mm are the original dimensions) A UNIT ...

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NXP Semiconductors 11. Abbreviations Table 12. Acronym ADC AMBA APB CPU DCC EMC FIFO GPIO JTAG PLL POR PWM RAM SPI SRAM SSI SSP TTL UART LPC2212_2214_4 Product data sheet Abbreviations Description Analog-to-Digital Converter Advanced Microcontroller Bus Architecture Advanced Peripheral ...

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NXP Semiconductors 12. Revision history Table 13. Revision history Document ID Release date LPC2212_2214_4 20080103 • Modiﬁcations: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have ...

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NXP Semiconductors 13. Legal information 13.1 Data sheet status [1][2] Document status Product status Objective [short] data sheet Development Preliminary [short] data sheet Qualiﬁcation Product [short] data sheet Production [1] Please consult the most recently issued document before initiating or ...

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NXP Semiconductors 15. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . ...

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