MCF5329DS ANALOGICTECH [Advanced Analogic Technologies], MCF5329DS Datasheet - Page 14

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MCF5329DS

Manufacturer Part Number
MCF5329DS
Description
MCF5329 ColdFire Microprocessor Data Sheet
Manufacturer
ANALOGICTECH [Advanced Analogic Technologies]
Datasheet
Mechanicals and Pinouts
4.4
Figure 4
14
196X
13X
3
e
X
E
Y
b
0.30
0.10 Z
shows the MCF5327CVM240 package dimensions.
S
Package Dimensions—196 MAPBGA
0.20
Z
14 13 12 11
X
Y
Laser mark for pin 1
identification in
this area
Figure 4. 196 MAPBGA Package Dimensions (Case No. 1128A-01)
10
Bottom View
Top View
9
View M-M
MCF5329 ColdFire
D
6
13X
S
5
e
4
3
2
®
Microprocessor Data Sheet, Rev. 0.1
1
Preliminary
M
A
B
C
D
E
F
G
H
K
L
N
P
J
Metalized mark for
pin 1 identification
in this area
K
M
M
A
A2
A1
Rotated 90 Clockwise
NOTES:
1. Dimensions are in millimeters.
2. Interpret dimensions and tolerances
3. Dimension B is measured at the
4. Datum Z (seating plane) is defined
5. Parallelism measurement shall
per ASME Y14.5M, 1994.
maximum solder ball diameter,
parallel to datum plane Z.
by the spherical crowns of the solder
balls.
exclude any effect of mark on top
surface of package.
Z
DIM
A1 0.27 0.47
A2 1.18 REF
Detail K
A 1.32 1.75
D 15.00 BSC
b 0.35 0.65
E 15.00 BSC
e
S
4
°
Min Max
Millimeters
1.00 BSC
0.50 BSC
Freescale Semiconductor
0.15 Z
5
0.30 Z

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