BD25B BEREX [BeRex Corporation], BD25B Datasheet

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BD25B

Manufacturer Part Number
BD25B
Description
Quadruple Band 2-Way SMT Power Divider
Manufacturer
BEREX [BeRex Corporation]
Datasheet
BeRex
1700~2500MHz USPCS & PCS, WCDMA & TD-SCDMA, WiBro
Product Description
Applications
 Base station Infrastructure
 Commercial/Industrial/Military wireless system
BD25B
Quadruple Band 2-Way SMT Power Divider
BeRex’s Divider BD25B is designed for PCS,
WCDMA & TD-SCDMA and WiBro band with
low Insertion Loss and Isolation. This chip is
fully passivated for enhanced performance
and reliability and packaged in RoHS-
compliant with SOIC-8 surface mount pack-
age. It can be used without back side ground
soldering. (This may degrade the perform-
ance at the high frequency edge.)
Device Features
Typical Isolation = 23 dB
Typical Insertion Loss = 0.5 dB
MSL 1 moisture rating
Lead-free/RoHS-compliant SOIC-8 Plastic Package
With exposed back side ground pad
Specifications and information are subject to change and products may be discontinued without notice. BeRex is a trademark of BeRex.
Evaluation Board Drawing
All other trademarks are the property of their respective owners. © 2010 BeRex
● website:
www.berex.com
Parameter
Parameter
Operation of this device above any of these parameters may result in permanent damage.
Typical Performance
Frequency Range
Insertion Loss
Isolation
IRL(S11)
ORL(S22/S33)
Amplitude Balance
Phase Balance
Input Power
Storage Temperature
Operating Temperature
Absolute Maximum Ratings
*All specifications apply to the following test conditions,
1. Device performance _ measured on BeRex E/B at 25
2. Insertion Loss: Above 3.0dB.
3. Back side ground _ soldered.
● email:
Pins 1,3,4,6 and 7 must be DC and RF grounded.
Function Block Diagram
sales@berex.com
1
1700
15
Min
Typical
0.05
0.5
-20
-23
0.7
23
°C, 50ohm system.
-55 to +155°C
1W CW dBm
-40 to +85°C
2500
Max
0.8
-15
-15
0.2
2.0
Rating
MHz
dBm
dBm
Unit
deg
dB
dB
dB
Rev. C
1

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BD25B Summary of contents

Page 1

... Lead-free/RoHS-compliant SOIC-8 Plastic Package With exposed back side ground pad Product Description BeRex’s Divider BD25B is designed for PCS, WCDMA & TD-SCDMA and WiBro band with low Insertion Loss and Isolation. This chip is fully passivated for enhanced performance and reliability and packaged in RoHS- compliant with SOIC-8 surface mount pack- age ...

Page 2

... BD25B Quadruple Band 2-Way SMT Power Divider 1700~2500MHz USPCS & PCS, WCDMA & TD-SCDMA, WiBro With Back Side Ground Soldering Parameters Unit Frequency Range MHz Insertion Loss dB Isolation dB IRL(S11) dB ORL(S22,S33) dB Phase Diff. deg Amplitude Balance dB Without Back Side Ground Soldering Parameters ...

Page 3

... BD25B Quadruple Band 2-Way SMT Power Divider 1700~2500MHz USPCS & PCS, WCDMA & TD-SCDMA, WiBro Insertion Loss vs. Frequency IRL vs. Frequency Notes) - BG: Data taken with backside ground soldering - NBG: Data taken without backside ground soldering ● website: BeRex Specifications and information are subject to change and products may be discontinued without notice. BeRex is a trademark of BeRex. ...

Page 4

... BD25B Quadruple Band 2-Way SMT Power Divider 1700~2500MHz USPCS & PCS, WCDMA & TD-SCDMA, WiBro ● website: BeRex Specifications and information are subject to change and products may be discontinued without notice. BeRex is a trademark of BeRex. All other trademarks are the property of their respective owners. © 2010 BeRex Package Outline Drawing ● ...

Page 5

... BD25B Quadruple Band 2-Way SMT Power Divider 1700~2500MHz USPCS & PCS, WCDMA & TD-SCDMA, WiBro Suggested PCB Land Pattern and PAD Layout PCB Land Pattern 0.047"(1.20) 0.157"(3.98) 0.040"(1.01) RF Out1 0.030"(0.76) 0.198"(5.02) Note : All dimension _ millimeters PCB lay out _ on BeRex website Tape & ...

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