FSL117MRIN FAIRCHILD [Fairchild Semiconductor], FSL117MRIN Datasheet - Page 14

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FSL117MRIN

Manufacturer Part Number
FSL117MRIN
Description
Manufacturer
FAIRCHILD [Fairchild Semiconductor]
Datasheet

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© 2012 Fairchild Semiconductor Corporation
FSL117MRN • Rev.1.0.0
Physical Dimensions
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the
warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
0.33 MIN
NOTES: UNLESS OTHERWISE SPECIFIED
A) THIS PACKAGE CONFORMS TO
B) ALL DIMENSIONS ARE IN MILLIMETERS.
C) DIMENSIONS ARE EXCLUSIVE OF BURRS,
D) DIMENSIONS AND TOLERANC ES PER
E) DRAWING FILENAME AND REVSION: MKT-N08FREV2.
5.08 MAX
JEDEC MS-001 VARIATION BA
MOLD FLASH, AND TIE BAR EXTRUSIONS.
ASME Y14.5M-1994
(0.56)
2.54
9.83
9.00
7.62
Figure 27. 8-Lead, Dual Inline Package, 8DIP.
0.56
0.355
6.67
6.096
1.65
1.27
3.60
3.00
14
3.683
3.20
0.356
0.20
9.957
7.87
8.255
7.61
7.62
www.fairchildsemi.com

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