HSDL9000 Agilent(Hewlett-Packard), HSDL9000 Datasheet
HSDL9000
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HSDL9000 Summary of contents
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Description The HSDL-9000 is a low cost, digital-output ambient light photo sensor in miniature industry- standard PLCC lead-free surface- mount package. It incorporates a photodiode, which peaks in human luminosity curve at 550 nm. Hence, it provides an excellent responsivity ...
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Ordering Information Part Number Packaging Type HSDL-9000 Tape and Reel Application Circuit For HSDL-9000 Ambient Light Photo Sensor ( ANALOG TO DIGITAL CIRCUITRY HSDL-9000 GND A0 (4) (2) Figure 1. Functional block diagram of HSDL-9000. ...
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Recommended Application Circuit Components Component C1 [4] Recommended R1 Values Incidence Light Threshold (Lux) R1 High Gain 220 k 5%, 0. 430 k 5%, 0. 910 k 5%, 0. Note: 4. Measurements are carried ...
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Absolute Maximum Ratings For implementations where case to ambient thermal resistance is 50 C/W Parameter Symbol Storage Temperature T S Operating Temperature T A Supply Voltage V CC Output Voltage: RxD V O Recommended Operating Conditions Parameter Symbol Operating Temperature ...
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HSDL-9000 Package Outline 4 ± 0.2 1.27 ± 0.1 1.27 ± 0 0.15 MAX. SEATING PLANE C 0.4 ± 0.1 Figure 3. Package outline dimensions. 5 0.15 MAX 3.2 ± 0.2 3.5 ± 0 ...
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Tape and Reel Dimensions UNIT: mm POLARITY PIN PIN 4: GND 0.304 ± 0.02 1.25 ± 0.1 EMPTY (40 mm MIN.) LABEL Figure 4. Tape and reel dimensions. 6 4.0 ± 0.1 2.0 ± 0.05 1.5 +0 ...
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Moisture Proof Packaging All HSDL-9000 options are shipped in moisture proof package. Once opened, moisture absorption begins. This part is compliant to JEDEC Level 2a. UNITS IN A SEALED MOISTURE-PROOF OPENED (UNSEALED) NO BAKING YES IS NECESSARY PERFORM RECOMMENDED BAKING ...
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Reflow Profile 255 230 220 200 R2 180 160 R1 120 100 P1 P2 HEAT SOLDER PASTE DRY UP Figure 6. Reflow graph. Process Symbol Heat Up P1, R1 Solder Paste Dry P2, R2 Solder Reflow ...
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Appendix A : SMT Assembly Application Note 1.0 Solder Pad, Mask and Metal Stencil Aperture STENCIL APERTURE SOLDER MASK Figure 7. Stencil and PCBA. 1.1 Recommended Land Pattern 1.5 0.6 3. UNITS: mm Figure 8. Stencil and PCBA. ...
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Recommended Metal Solder Stencil Aperture It is recommended that only a 0.152 mm (0.006 inches) thick stencil be used for solder paste printing. This is to ensure adequate printed solder paste volume and no shorting. Aperture opening for shield ...
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Appendix B: PCB Layout Suggestion The following PCB layout shows a recommended layout that should result in good electrical and EMI performance. Things to note: 1. The ground plane should be continuous under the part, but should not extend under ...
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Appendix C: Optical Window Design for HSDL-9000 Optical Window Dimensions To ensure that the performance of the HSDL-9000 will not be affected by improper window design, there are some con- straints on the dimensions and design of the window. There ...
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The table and figure below show the recommended dimensions of the window. These dimension values are based on a window thickness of 1.0 mm with a refractive index 1.585. Figure 13. Recommended window dimensions. WD: Working Distance between window front ...
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Figure 14. Placement of the window. www.agilent.com/semiconductors For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (408) 654-8675 Europe: +49 (0) 6441 92460 China: 10800 ...