HSDL9000 Agilent(Hewlett-Packard), HSDL9000 Datasheet - Page 10

• Manufacturer Part Number: HSDL9000
• Description: Miniature Surface-Mount Ambient Light Photo Sensor
• Manufacturer: Agilent(Hewlett-Packard)

1.2 Recommended Metal Solder
Stencil Aperture
It is recommended that only a
0.152 mm (0.006 inches) thick
stencil be used for solder paste
printing. This is to ensure
adequate printed solder paste
volume and no shorting.
Aperture opening for shield pad
is 1.5 mm x 0.6 mm as per land
pattern.
1.3 Adjacent Land Keepout and
Solder Mask Areas
Adjacent land keep-out is the
maximum space occupied by
the unit relative to the land
pattern. There should be no other
SMD components within this
area.
The minimum solder resist strip
width required to avoid solder
bridging adjacent pads is
0.2 mm.
Note: Wet/Liquid Photo-
Imageable solder resist/mask is
recommended.
10
Figure 9. Solder stencil aperture.
UNITS: mm
Figure 10. Adjacent land keepout and solder mask areas.
0.2 MIN.
3.14
C L
APERTURES AS PER
LAND DIMENSION
SOLDER MASK
5.1
C L
4.7
4.8
0.152