X28C010 Xicor, X28C010 Datasheet
X28C010
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X28C010 Summary of contents
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... The Xicor X28C010 is a 128K with Xicor's proprietary, high performance, floating gate CMOS technology. Like all Xicor programmable non- Control Circuits volatile memories the X28C010 only device. The PP X28C010 features the JEDEC approved pinout for byte- wide memories, compatible with industry standard EPROMs ...
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... The Output Enable input controls the data output buffers and is used to initiate read operations. Data In/Data Out (I/O –I Data is written to or read from the X28C010 through the I/O pins. Write Enable (WE) The Write Enable input controls the writing of data to the X28C010. FUNCTIONAL DIAGRAM A 8 – – ...
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... The X28C010 features DATA Polling as a method to indicate to the host system that the byte write or page write cycle has completed. DATA Polling allows a simple bit test operation to determine the status of the X28C010, eliminating additional interrupt inputs or external hard- ware. During the internal programming cycle, any at- ...
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... READY HIGH DATA Polling can effectively halve the time for writing to the X28C010. The timing diagram in Figure 2 illustrates the sequence of events on the bus. The software flow diagram in Figure 3 illustrates one method of implement- ing the routine. NO 3858 FHD F13 4 ...
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... DATA Polling. This can be especially helpful in an array comprised of multiple X28C010 memories that is frequently updated. Toggle Bit Polling can also provide a method for status checking in multiprocessor applications. The timing diagram in Figure 4 illustrates the sequence of events on the bus ...
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... SOFTWARE DATA PROTECTION The X28C010 offers a software controlled data protec- tion feature. The X28C010 is shipped from Xicor with the software data protection NOT ENABLED: that is the device will be in the standard operating mode. In this mode data should be protected during power-up/-down operations through the use of external circuits ...
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... BLC MAX Regardless of whether the device has previously been protected or not, once the software data protection algorithm is used and data has been written, the X28C010 will automatically disable further writes unless another command is issued to cancel it further commands are issued the X28C010 will be write protected during power-down and after any subsequent power-up ...
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... E PROM programmer, the following six step algo- rithm will reset the internal protection circuit. After t the X28C010 will be in standard operating mode. Note: Once initiated, the sequence of write operations should not be interrupted. 3858 FHD F19 8 ...
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... X28C010 SYSTEM CONSIDERATIONS Because the X28C010 is frequently used in large memory arrays it is provided with a two line control architecture for both read and write operations. Proper usage can provide the lowest possible power dissipation and elimi- nate the possibility of contention where multiple I/O pins share the same bus ...
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... X28C010 ABSOLUTE MAXIMUM RATINGS* Temperature under Bias X28C010 ...................................... – +85 C X28C010I ................................... – +135 C X28C010M ................................. – +135 C Storage Temperature ....................... – +150 C Voltage on any Pin with Respect ....................................... D.C. Output Current ............................................. 5mA Lead Temperature (Soldering, 10 seconds) .............................. 300 C RECOMMEND OPERATING CONDITIONS Temperature Min ...
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... X28C010 POWER-UP TIMING Symbol PUR (2) t Power-up to Read Operation t PUW (2) Power-up to Write Operation CAPACITANCE 1MHz Symbol I/O (2) C Input/Output Capacitance (2) C Input Capacitance IN ENDURANCE AND DATA RETENTION Parameter Endurance Endurance Data Retention A.C. CONDITIONS OF TEST Input Pulse Levels Input Rise and ...
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... DATA I/O Note: (3) t min., min., and OLZ OHZ 5pF, from the point when return HIGH (whichever occurs first) to the time when the outputs are no longer driven. X28C010-12 X28C010-15 X28C010-20 X28C010-25 Min. Max. Min. 120 150 120 120 ...
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... X28C010 Write Cycle Limits Symbol (4) t Write Cycle Time WC t Address Setup Time AS t Address Hold Time AH t Write Setup Time CS t Write Hold Time CH CE Pulse Width HIGH Setup Time t OES OE HIGH Hold Time t OEH WE Pulse Width HIGH Recovery ...
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... X28C010 CE Controlled Write Cycle ADDRESS OES DATA IN DATA OUT Page Write Cycle ( (6) ADDRESS * I/O BYTE 0 *For each successive write within the page write operation –A 16 should be the same or writes to an unknown address could occur. ...
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... X28C010 DATA Polling Timing Diagram (7) ADDRESS I/O 7 Toggle Bit Timing Diagram OEH OE HIGH Z I I/O 6 beginning and ending state will vary. Note: (7) Polling operations are by definition read cycles and are therefore subject to read cycle timings OEH D OUT =X ...
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... X28C010 NOTES 16 ...
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... X28C010 PACKAGING INFORMATION 32-LEAD HERMETIC DUAL IN-LINE PACKAGE TYPE D PIN 1 SEATING PLANE 0.150 (3.8) MIN. 0.200 (5.08) 0.150 (3.18) TYP. 0.018 (0.46) 0.015 (0.33) 0.008 (0.20) NOTE: ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS) 1.690 (42.95) MAX. 0.065 (1.65) 0.033 (0.84) 0.110 (2.79) TYP. 0.055 (1.40) 0.090 (2.29) 0.620 (15.75) 0.590 (14.99) TYP. 0.614 (15.60) 17 0.610 (15.49) 0.500 (12.70) 0.005 (0.13) MIN. ...
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... X28C010 PACKAGING INFORMATION 32-PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE TYPE E PIN 1 0.200 (5.08) BSC 0.028 (0.71) 0.022 (0.56) (32) PLCS. 0.458 (11.63) 0.442 (11.22) 0.458 (11.63) 0.300 (7.62) NOTE: 1. ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS) 2. TOLERANCE: 1% NLT 0.005 (0.127) 0.150 (3.81) BSC 0.020 (0.51 REF. 0.095 (2.41) 0.075 (1.91) 0.022 (0.56) 0.006 (0.15) 0.055 (1.39) 0.045 (1.14) TYP ...
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... X28C010 PACKAGING INFORMATION 0.828 (21.04) 0.812 (20.64) 0.0065 (0.17) 0.004 (0.10) 0.370 (9.40) 0.300 (7.62) NOTE: ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS) 32-LEAD CERAMIC FLAT PACK PIN 1 INDEX 1 32 0.440 (11.18) 0.430 (10.93) 0.347 (8.82) 0.333 (8.46) 19 0.019 (0.48) 0.015 (0.38) 0.055 (1.40) 0.045 (1.14) 0.045 (1.14) MAX. 0.005 (0.13) MIN. 0.130 (3.30) 0.090 (2.29) 0.047 (1.19) 0.026 (0.66) 3926 FHD F20 ...
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... X28C010 PACKAGING INFORMATION 32-LEAD PLASTIC LEADED CHIP CARRIER PACKAGE TYPE J 0.420 (10.67) 0.045 (1.14 0.495 (12.57) 0.485 (12.32) TYP. 0.490 (12.45) 0.453 (11.51) 0.447 (11.35) TYP. 0.450 (11.43) 0.300 (7.62) REF. PIN 1 NOTES: 1. ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS) 2. DIMENSIONS WITH NO TOLERANCE FOR REFERENCE ONLY 0.050" TYPICAL 0.510" TYPICAL 0.400" ...
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... X28C010 PACKAGING INFORMATION 36-LEAD CERAMIC PIN GRID ARRAY PACKAGE TYPE TYP. 0.180 (.010) (4.57 .25 CORNERS TYP. 0.180 (.010) (4.57 4 CORNERS PIN 1 INDEX 0.770 (19.56) 0.750 (19.05) SQ NOTE: ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS ...
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... X28C010 PACKAGING INFORMATION 32-LEAD CERAMIC SMALL OUTLINE GULL WING PACKAGE TYPE R 0.340 0.007 0.0192 0.0138 0.840 MAX. 0.050 0.440 MAX. 0.560 NOM. NOTES: 1. ALL DIMENSIONS IN INCHES 2. FORMED LEAD SHALL BE PLANAR WITH RESPECT TO ONE ANOTHER WITHIN 0.004 INCHES SEE DETAIL “A” ...
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... X28C010 PACKAGING INFORMATION 32-PAD STRETCHED CERAMIC LEADLESS CHIP CARRIER PACKAGE TYPE N PIN 1 0.400 BSC 0.700 0.010 NOTE: 1. ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS) 2. TOLERANCE: 1% NLT 0.005 (0.127) 0.300 BSC 0.035 x 45 REF. 0.085 0.010 DETAIL A 0.020 (1.02 REF. TYP. (3) PLCS. 0.050 BSC ...
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... X28C010 PACKAGING INFORMATION 12.522 (0.493) 12.268 (0.483) 1.143 (0.045) 0.965 0.889 (0.035) PIN #1 IDENT. (0.038) O 1.016 (0.040) O 0.762 (0.030) 1 10.058 (0.396) 9.957 (0.392) A 14.148 (0.557) 13.894 (0.547) 14.80 0.05 (0.583 0.002) 0.30 (0.012 SOLDER PADS TYPICAL 40 PLACES 0.17 (0.007) 0.03 (0.001) FOOTPRINT NOTE: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (INCHES IN PARENTHESES). ...
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... A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system affect its safety or effectiveness. X28C010 Access Time – ...