AT17N002 ATMEL Corporation, AT17N002 Datasheet - Page 10

• Manufacturer Part Number: AT17N002
• Description: FPGA Configuration Memory
• Manufacturer: ATMEL Corporation

Thermal Resistance Coefficients
Notes:
10
Package Type
8CN4
8P3
8S1
20S2
44A
1. For more information refer to the “Thermal Characteristics of Atmel’s Packages”, available on the Atmel web site.
2. Airflow = 0 ft/min.
Leadless Array Package (LAP)
Plastic Dual Inline Package
(PDIP)
Plastic Gull Wing Small Outline
(SOIC)
Plastic Gull Wing Small Outline
(SOIC)
Thin Plastic Quad Flat
Package (TQFP)
AT17N256/512/010/002/040
θ
θ
[°C/W]
θ
θ
[°C/W]
θ
θ
[°C/W]
θ
θ
[°C/W]
θ
θ
[°C/W]
JC
JA
JC
JA
JC
JA
JC
JA
JC
JA
[°C/W]
[°C/W]
[°C/W]
[°C/W]
[°C/W]
(2)
(2)
(2)
(2)
(2)
(1)
AT17N256
107
150
37
45
–
–
–
–
AT17N512/
AT17N010
135.71
107
45
37
–
–
–
–
AT17N002
159.60
45
17
62
–
–
–
–
3020A–CNFG–04/10/03
AT17N040
17
62
–
–
–
–
–
–
–
–