HCS283D Intersil Corporation, HCS283D Datasheet
HCS283D
Related parts for HCS283D
HCS283D Summary of contents
Page 1
... SBDIP Package (D suffix). Ordering Information PART NUMBER TEMPERATURE RANGE HCS283DMSR HCS283KMSR HCS283D/Sample HCS283K/Sample HCS283HMSR CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 1999 HCS283MS 4-Bit Full Adder with Fast Carry ...
Page 2
Functional Diagram CIN GND 16 VCC S0 4 HCS283MS COUT 10 9 518850 Spec Number ...
Page 3
Absolute Maximum Ratings Supply Voltage (VCC -0.5V to +7.0V Input Voltage Range, All Inputs . . ...
Page 4
TABLE 2. AC ELECTRICAL PERFORMANCE CHARACTERISTICS PARAMETER SYMBOL Propagation Delay CIN to SO TPHL TPLH CIN to S1 TPHL TPLH CIN to S2, CO TPHL TPLH CIN to S3 TPHL TPLH An TPHL TPLH An ...
Page 5
TABLE 4. POSTIRRADIATION ELECTRICAL PERFORMANCE CHARACTERISTICS PARAMETER SYMBOL Supply Current ICC VCC = 5.5V, VIN = VCC or GND Output Current (Sink) IOL VCC = VIH = 4.5V, VOUT = 0.4V, VIL = 0V Output Current IOH VCC = VIH ...
Page 6
CONFORMANCE GROUPS Initial Test (Preburn-In) Interim Test I (Postburn-In) Interim Test II (Postburn-In) PDA Interim Test III (Postburn-In) PDA Final Test Group A (Note 1) Group B Subgroup B-5 Subgroup B-6 Group D NOTE: 1. Alternate group A inspection in ...
Page 7
Intersil Space Level Product Flow - ‘MS’ Wafer Lot Acceptance (All Lots) Method 5007 (Includes SEM) GAMMA Radiation Verification (Each Wafer) Method 1019, 4 Samples/Wafer, 0 Rejects 100% Nondestructive Bond Pull, Method 2023 Sample - Wire Bond Pull Monitor, Method ...
Page 8
... All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification. Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use ...
Page 9
Die Characteristics DIE DIMENSIONS mils 2.21mm x 2.19mm METALLIZATION: Type: AlSi Å Å Metal Thickness: 11k 1k GLASSIVATION: Type: SiO 2 Å Å Thickness: 13k 2.6k WORST CASE CURRENT DENSITY <2 A/cm BOND ...