HCS165D Intersil Corporation, HCS165D Datasheet
HCS165D
Related parts for HCS165D
HCS165D Summary of contents
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... SBDIP Package (D suffix). Ordering Information PART NUMBER TEMPERATURE RANGE HCS165DMSR HCS165KMSR HCS165D/Sample HCS165K/Sample HCS165HMSR CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 1999 HCS165MS 8-Bit Parallel-Input/Serial Output Shift Register ...
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Functional Diagram OPERATING MODES PL Parallel Load L L Serial Shift H H Hold “Do Nothing” HIGH voltage level h = HIGH voltage level one ...
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Absolute Maximum Ratings Supply Voltage (VCC -0.5V to +7.0V Input Voltage Range, All Inputs . . ...
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TABLE 2. AC ELECTRICAL PERFORMANCE CHARACTERISTICS PARAMETER SYMBOL TPLH VCC = 4.5V Q7 TPHL PEN TPLH VCC = 4.5V TPHL TPLH VCC = 4.5V TPHL D7 to ...
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TABLE 4. DC POST RADIATION ELECTRICAL PERFORMANCE CHARACTERISTICS PARAMETER SYMBOL Quiescent Current ICC Output Current (Sink) IOL Output Current IOH (Source) Output Voltage Low VOL Output Voltage High VOH Input Leakage Current IIN Noise Immunity FN Functional Test CP or ...
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CONFORMANCE GROUPS Initial Test (Preburn-In) Interim Test I (Postburn-In) Interim Test II (Postburn-In) PDA Interim Test III (Postburn-In) PDA Final Test Group A (Note 1) Group B Subgroup B-5 Subgroup B-6 Group D NOTES: 1. Alternate Group A testing in ...
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Intersil Space Level Product Flow - ‘MS’ Wafer Lot Acceptance (All Lots) Method 5007 (Includes SEM) GAMMA Radiation Verification (Each Wafer) Method 1019, 4 Samples/Wafer, 0 Rejects 100% Nondestructive Bond Pull, Method 2023 Sample - Wire Bond Pull Monitor, Method ...
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... All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification. Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use ...
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Die Characteristics DIE DIMENSIONS mils METALLIZATION: Type: AlSi Å Å Metal Thickness: 11k 1k GLASSIVATION: Type: SiO 2 Å Å Thickness: 13k 2.6k WORST CASE CURRENT DENSITY < 2 A/cm BOND PAD SIZE: ...