SAA5531 Philips Semiconductors, SAA5531 Datasheet - Page 2

• Manufacturer Part Number: SAA5531
• Description: Enhanced TV microcontrollers with On-Screen Display OSD
• Manufacturer: Philips Semiconductors

Philips Semiconductors
CONTENTS
1
2
3
4
5
6
6.1
6.2
7
7.1
8
8.1
8.2
8.3
8.4
8.5
8.6
8.7
9
10
10.1
10.2
10.3
11
11.1
11.2
11.3
11.4
12
12.1
12.2
12.3
12.4
13
14
14.1
15
15.1
15.2
15.3
16
16.1
2000 Feb 23
Enhanced TV microcontrollers with
On-Screen Display (OSD)
FEATURES
GENERAL DESCRIPTION
QUICK REFERENCE DATA
ORDERING INFORMATION
BLOCK DIAGRAM
PINNING INFORMATION
Pinning
Pin description
MICROCONTROLLER
Microcontroller features
MEMORY ORGANIZATION
ROM bank switching
Security bits - program and verify
RAM organisation
Data memory
SFR memory
Character set feature bits
External (Auxiliary) memory
POWER-ON RESET
REDUCED POWER MODES
Idle mode
Power-down mode
Standby mode
I/O FACILITY
I/O ports
Port type
Port alternative functions
LED support
INTERRUPT SYSTEM
Interrupt enable structure
Interrupt enable priority
Interrupt vector address
Level/edge interrupt
TIMER/COUNTER
WATCHDOG TIMER
Watchdog Timer operation
PULSE WIDTH MODULATORS
PWM control
Tuning Pulse Width Modulator (TPWM)
Software ADC (SAD)
I
I
2
2
C-BUS SERIAL I/O
C-bus port selection
2
17
17.1
17.2
17.3
17.4
18
18.1
19
19.1
19.2
19.3
19.4
19.5
19.6
19.7
19.8
19.9
19.10
19.11
19.12
19.13
19.14
19.15
19.16
19.17
20
21
22
23
23.1
23.2
23.3
24
25
26
27
28
28.1
28.2
28.3
28.4
29
30
31
MEMORY INTERFACE
Memory structure
Memory mapping
Addressing memory
Page clearing
DATA CAPTURE
Data Capture features
DISPLAY
Display features
Display modes
Display feature descriptions
Character and attribute coding
Screen and global controls
Screen colour
Text display controls
Soft scroll action
Display positioning
Character set
ROM addressing
Redefinable characters
Display synchronization
Video/data switch (Fast Blanking) polarity
Video/Data switch adjustment
RGB brightness control
Contrast reduction
MEMORY MAPPED REGISTERS (MMR)
LIMITING VALUES
CHARACTERISTICS
QUALITY AND RELIABILITY
Group A
Group B
Group C
APPLICATION INFORMATION
EMC GUIDELINES
REFERENCES
PACKAGE OUTLINE
SOLDERING
Introduction to soldering through-hole mount
packages
Soldering by dipping or by solder wave
Manual soldering
Suitability of through-hole mount IC packages
for dipping and wave soldering methods
DEFINITIONS
LIFE SUPPORT APPLICATIONS
PURCHASE OF PHILIPS I
Preliminary specification
2
C COMPONENTS
SAA55xx