AS7C33128PFS18B-133TQC ALSC [Alliance Semiconductor Corporation], AS7C33128PFS18B-133TQC Datasheet - Page 4
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AS7C33128PFS18B-133TQC
Manufacturer Part Number
AS7C33128PFS18B-133TQC
Description
3.3V 128K x 18 pipeline burst synchronous SRAM
Manufacturer
ALSC [Alliance Semiconductor Corporation]
Datasheet
1.AS7C33128PFS18B-133TQC.pdf
(19 pages)
Functional description
The AS7C33128PFS18B is a high performance CMOS 2 Mbit synchronous Static Random Access Memory (SRAM) devices
organized as 131,072 words × 18 bits and incorporate a pipeline for highest frequency on any given technology.
Timing for this device is compatible with existing Pentium
ASIC, DSP, and PowerPC
Fast cycle times of 5.0/6.0/7.5 ns with clock access times (t
frequencies. Three chip enable inputs permit easy memory expansion. Burst operation is initiated in one of two ways: the
controller address strobe (ADSC), or the processor address strobe (ADSP). The burst advance pin (ADV) allows subsequent
internally generated burst addresses.
Read cycles are initiated with ADSP (regardless of WE and ADSC) using the new external address clocked into the on-chip
address register. When ADSP is sampled LOW, the chip enables are sampled active, and the output buffer is enabled with OE.
In a read operation the data accessed by the current address, registered in the address registers by the positive edge of CLK, are
carried to the data-out registers and driven on the output pins on the next positive edge of CLK. ADV is ignored on the clock
edge that samples ADSP asserted but is sampled on all subsequent clock edges. Address is incremented internally for the next
access of the burst when ADV is sampled LOW and both address strobes are HIGH. Burst mode is selectable with the LBO
input. With LBO unconnected or driven HIGH, burst operations use a Pentium
device uses a linear count sequence suitable for PowerPC
Write cycles are performed by disabling the output buffers with OE and asserting a write command. A global write enable
GWE writes all 18 bits regardless of the state of individual BW[a:b] inputs. Alternately, when GWE is HIGH, one or more
bytes may be written by asserting BWE and the appropriate individual byte BWn signal(s).
BWn is ignored on the clock edge that samples ADSP LOW, but is sampled on all subsequent clock edges. Output buffers are
disabled when BWn is sampled LOW (regardless of OE). Data is clocked into the data input register when BWn is sampled
LOW. Address is incremented internally to the next burst address if BWn and ADV are sampled LOW.
Read or write cycles may also be initiated with ADSC instead of ADSP. The differences between cycles initiated with ADSC
and ADSP are as follows:
• ADSP must be sampled HIGH when ADSC is sampled LOW to initiate a cycle with ADSC.
• WE signals are sampled on the clock edge that samples ADSC LOW (and ADSP HIGH).
• Master chip select CE0 blocks ADSP, but not ADSC.
The AS7C33128PFS18B operates from a 3.3V supply. I/Os use a separate power supply that can operate at 2.5V or 3.3V.
These devices are available in a 100-pin 14×20 mm TQFP package.
TQFP capacitance
* Guaranteed not tested
TQFP thermal resistance
1 This parameter is sampled
1. PowerPC
Input capacitance
I/O capacitance
Thermal resistance
(junction to ambient)
Thermal resistance
(junction to top of case)
12/10/04; v.1.4
Parameter
Description
™
is a trademark International Business Machines Corporation
1
1
Symbol
C
™
C
I/O
1
IN
-based systems in computing, datacom, instrumentation, and telecommunications systems.
*
*
Test conditions follow standard test methods and
procedures for measuring thermal impedance,
Test conditions
V
V
OUT
IN
per EIA/JESD51
Alliance Semiconductor
= 0V
Conditions
= 0V
™
®
and many other applications.
synchronous cache specifications. This architecture is suited for
Min
CD
-
-
®
) of 3.0/3.5/4.0 ns enable 200, 166 and 133 MHz bus
Max
1–layer
4–layer
5
7
®
count sequence. With LBO driven LOW the
Unit
pF
pF
Symbol
θ
θ
θ
JA
JA
JC
AS7C33128PFS18B
Typical
40
22
8
P. 4 of 19
Units
°C/W
°C/W
°C/W