AM29F010B120DGC1 AMD [Advanced Micro Devices], AM29F010B120DGC1 Datasheet
AM29F010B120DGC1
Related parts for AM29F010B120DGC1
AM29F010B120DGC1 Summary of contents
Page 1
Data Sheet July 2003 The following document specifies Spansion memory products that are now offered by both Advanced Micro Devices and Fujitsu. Although the document is marked with the name of the company that orig- inally developed the specification, these ...
Page 2
THIS PAGE LEFT INTENTIONALLY BLANK. ...
Page 3
SUPPLEMENT Am29F010B Known Good Die 1 Megabit (128 K x 8-Bit) CMOS 5.0 Volt-only, Uniform Sector Flash Memory—Die Revision 1 DISTINCTIVE CHARACTERISTICS Single power supply operation — 5.0 V ± 10% for read, erase, and program operations — Simplifies system-level ...
Page 4
GENERAL DESCRIPTION The Am29F010B in Known Good Die (KGD) form Mbit, 5.0 Volt-only Flash memory. AMD defines KGD as standard product in die form, tested for functionality and speed. AMD KGD products have the same reli- ability ...
Page 5
PRODUCT SELECTOR GUIDE Family Part Number = 5.0 V ± 10%) Speed Option (V CC Max Access Time, t (ns) ACC Max CE# Access, t (ns) CE Max OE# Access, t (ns) OE DIE PHOTOGRAPH ...
Page 6
PAD DESCRIPTION Pad Signal A16 3 A15 4 A12 ...
Page 7
ORDERING INFORMATION Standard Products AMD KGD products are available in several packages and operating ranges. The order number (Valid Combination) is formed by a combination of the following: Am29F010B - DEVICE NUMBER/DESCRIPTION Am29F010B Known Good Die 1 Megabit ...
Page 8
PACKAGING INFORMATION Surftape Packaging Direction of Feed Gel-Pak and Waffle Pack Packaging Orientation relative to top left corner of Gel-Pak and Waffle Pack cavity plate AMD logo location Am29F010B ...
Page 9
PRODUCT TEST FLOW Figure 1 provides an overview of AMD’s Known Good Die test flow. For more detailed information, refer to the Am29F010B product qualification database supple- ment for KGD. AMD implements quality assurance pro- cedures throughout the product test ...
Page 10
PHYSICAL SPECIFICATIONS Die dimensions . . . . . . . . . . . . . . . 90 mils x 159 mils 2. 4.04 mm Die Thickness ...
Page 11
TERMS AND CONDITIONS OF SALE FOR AMD NON-VOLATILE MEMORY DIE All transactions relating to unpackaged die under this agreement shall be subject to AMD’s standard terms and conditions of sale, or any revisions thereof, which revisions AMD reserves the right ...
Page 12
REVISION SUMMARY Revision A+1 (August 4, 2000) Physical Specifications Deleted Si from bond pad metalization specification Revision A+2 (June 27, 2001) Added Penang, Malaysia test facility (ACN ...
Page 13
Trademarks Copyright © 2003 Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD logo, and combinations thereof are registered trademarks of Advanced Micro Devices, Inc. ExpressFlash is a trademark of Advanced Micro Devices, Inc. Product names used in this ...
Page 14
Sales Offices and Representatives North America ALABAMA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...