CMZB27 TOSHIBA Semiconductor CORPORATION, CMZB27 Datasheet

CMZB27

Manufacturer Part Number

CMZB27

Description

Manufacturer

TOSHIBA Semiconductor CORPORATION

Datasheet

1.CMZB18.pdf (5 pages)

Specifications of CMZB27

Date_code

10+

Packing_info

SMA

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Applications:

Communication, Control and

Measurement Equipment

Constant Voltage Regulation

Transient Suppressors

•

Absolute Maximum Ratings

Standard Soldering Pad

Average power dissipation

Zener voltage

Suitable for high-density board assembly due to the use of a small

surface-mount package, M−FLAT

Power dissipation

Junction temperature

Storage temperature range

Note 1: Ta = 40°C

Note 2: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the

1.4

Device mounted on a glass-epoxy board

Board size: 50 mm × 50 mm

Soldering size: 6 mm × 6 mm

Board thickness: 1.6 t

significant change in temperature, etc.) may cause this product to decrease in the reliability significantly

even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute

maximum ratings.

Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook

(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test

report and estimated failure rate, etc).

Characteristics

3.0

CMZB18~CMZB51

TOSHIBA Zener Diode Silicon Diffused Type

: P = 1.0 W

: V

1.4

(Ta = 25°C)

= 18 V ~ 51 V

Unit: mm

Symbol

stg

−40~150

1.0 (Note 1)

Rating

Unit

°C

Weight: 0.023 g (typ.)

JEDEC

JEITA

TOSHIBA

CMZB18~CMZB51

3-4E1A

2007-11-27

―

Unit: mm

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