AM29LV800B-1 AMD [Advanced Micro Devices], AM29LV800B-1 Datasheet - Page 6

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AM29LV800B-1

Manufacturer Part Number
AM29LV800B-1
Description
8 Megabit (1 M x 8-Bit/512 K x 16-Bit) CMOS 3.0 Volt-only, Boot Sector Flash Memory-Die Revision 1
Manufacturer
AMD [Advanced Micro Devices]
Datasheet
ORDERING INFORMATION
Standard Products
AMD standard products are available in several packages and operating ranges. The order number (Valid Combination) is
formed by a combination of the following:
6
Am29LV800BT-90
Am29LV800BB-90
Am29LV800BT-120
Am29LV800BB-120
Am29LV800B
Valid Combinations
T
-90
DP
DGC 1, DGI 1,
DWC 1, DWI 1
DPC 1, DPI 1,
DTC 1, DTI 1,
5
Am29LV800B Known Good Die
DEVICE NUMBER/DESCRIPTION
Am29LV800B Known Good Die
8 Megabit (1 M x 8-Bit/512 K x 16-Bit) CMOS Flash Memory—Die Revision 1
3.0 Volt-only Program and Erase
S U P P L E M E N T
C
1
Valid Combinations list configurations planned to be sup-
ported in volume for this device. Consult the local AMD sales
office to confirm availability of specific valid combinations and
to check on newly released combinations.
DIE REVISION
This number refers to the specific AMD manufacturing
process and product technology reflected in this document.
It is entered in the revision field of AMD standard product
nomenclature.
TEMPERATURE RANGE
C = Commercial (0 C to +70 C)
I = Industrial (–40 C to +85 C)
DIE THICKNESS
5 = 500 m
PACKAGE TYPE AND MINIMUM ORDER QUANTITY*
DP = Waffle Pack
DG = Gel-Pak
DT = Surftape™ (Tape and Reel)
DW = Gel-Pak
* Contact an AMD representative for quantities.
SPEED OPTION
See Product Selector Guide and Valid Combinations
BOOT CODE SECTOR ARCHITECTURE
T = Top sector
B = Bottom sector
Die per 5 tray stack
Die per 7-inch reel
Call AMD sales office for minimum order quantity
Die per 6 tray stack
®
®
Valid Combinations
Die Tray
Wafer Tray (sawn wafer on frame)

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