SIGC100T60R3_10 INFINEON [Infineon Technologies AG], SIGC100T60R3_10 Datasheet

no-image

SIGC100T60R3_10

Manufacturer Part Number
SIGC100T60R3_10
Description
600V Trench & Field Stop technology positive temperature coefficient
Manufacturer
INFINEON [Infineon Technologies AG]
Datasheet
IGBT
Features:
Mechanical Parameter
Raster size
Emitter pad size (incl. gate pad)
Gate pad size
Area total
Thickness
Wafer size
Max.possible chips per wafer
Passivation frontside
Pad metal
Backside metal
Die bond
Wire bond
Reject ink dot size
Recommended storage environment
Edited by INFINEON Technologies, IMM PSD, L7601AA, Edition 2.1, 04.05.2010
SIGC100T60R3
600V Trench & Field Stop technology
low V
low turn-off losses
short tail current
positive temperature coefficient
easy paralleling
Chip Type
3
Chip
CE(sat)
600V
V
CE
200A
I
C
9.73 x 10.23 mm
This chip is used for:
Applications:
environment, < 6 month at an ambient temperature of 23°C
Die Size
power module
drives
Store in original container, in dry nitrogen, in dark
suitable for epoxy and soft solder die bonding
Electrically conductive glue or solder
( 4.256 x 1.938 ) x 4
( 4.256 x 2.356 ) x 4
1.615 x 0.817
9.73 x 10.23
2
0.65mm ; max 1.2mm
SIGC100T60R3
3200 nm AlSiCu
99.5
150
Ni Ag –system
70
Al, <500µm
Photoimide
126
sawn on foil
Package
G
mm
mm
µm
C
E
2

Related parts for SIGC100T60R3_10

SIGC100T60R3_10 Summary of contents

Page 1

IGBT Chip Features: 600V Trench & Field Stop technology low V CE(sat) low turn-off losses short tail current positive temperature coefficient easy paralleling Chip Type V CE SIGC100T60R3 600V Mechanical Parameter Raster size Emitter pad size (incl. gate pad) ...

Page 2

Maximum Ratings Parameter Collector-Emitter voltage collector current, limited by T Pulsed collector current, t limited Gate emitter voltage Junction temperature range Operating junction temperature 2 ) Short circuit data V = 15V, ...

Page 3

Further Electrical Characteristic Switching characteristics and thermal properties are depending strongly on module design and mounting technology and can therefore not be specified for a bare die. Edited by INFINEON Technologies, IMM PSD, L7601AA, Edition 2.1, 04.05.2010 SIGC100T60R3 ...

Page 4

Chip Drawing Emitter pad G = Gate pad T = Test pad do not contact Edited by INFINEON Technologies, IMM PSD, L7601AA, Edition 2.1, 04.05.2010 SIGC100T60R3 ...

Page 5

Description AQL 0,65 for visual inspection according to failure catalogue Electrostatic Discharge Sensitive Device according to MIL-STD 883 Revision History Version 2.1 Published by Infineon Technologies AG 81726 Munich, Germany © 2010 Infineon Technologies AG All Rights Reserved. Legal Disclaimer ...

Related keywords