SIGC10T60S INFINEON [Infineon Technologies AG], SIGC10T60S Datasheet
SIGC10T60S
Related parts for SIGC10T60S
SIGC10T60S Summary of contents
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... Ni Ag –system suitable for epoxy and soft solder die bonding electrically conductive glue or solder store in original container, in dry nitrogen, < 6 month at an ambient temperature of 23°C SIGC10T60S G Package Ordering Code Q67050- sawn on foil A4361-A101 mm 10.2 / 7.1 mm ...
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... Symbol Conditions SIGC10T60S Value 600 -40 ... +175 Value min. typ. max. = 2mA 600 C =20A 1.5 2. 4.1 4.9 5 =0V 1 ...
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... CHIP DRAWING: Edited by INFINEON Technologies CLS, L7541D, Edition 2, 26.01.2005 SIGC10T60S ...
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... Life support devices or systems are intended to be implanted in the human body support and / or maintain and sustain and / or protect human life. If they fail reasonable to assume that the health of the user or other persons may be endangered. Edited by INFINEON Technologies CLS, L7541D, Edition 2, 26.01.2005 SIGC10T60S IKB20N60T ...