SIGC144T170R2C_09 INFINEON [Infineon Technologies AG], SIGC144T170R2C_09 Datasheet

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SIGC144T170R2C_09

Manufacturer Part Number
SIGC144T170R2C_09
Description
IGBT Chip in NPT-technology 1700V NPT technology 280 ?m chip
Manufacturer
INFINEON [Infineon Technologies AG]
Datasheet
IGBT Chip in NPT-technology
Features:
Mechanical Parameter
Raster size
Emitter pad size
Gate pad size
Area total
Thickness
Wafer size
Max.possible chips per wafer
Passivation frontside
Pad metal
Backside metal
Die bond
Wire bond
Reject ink dot size
Recommended storage environment
Edited by INFINEON Technologies, AIM IMM, L7361M, Edition 2.1, 11.11.2009
SIGC144T170R2C 1700V
1700V NPT technology
280 µm chip
short circuit prove
positive temperature coefficient
easy paralleling
Chip Type
V
CE
75A
I
C
11.98 x 11.98 mm
This chip is used for:
Applications:
environment, < 6 month at an ambient temperature of 23°C
Die Size
chip only
drives
Store in original container, in dry nitrogen, in dark
suitable for epoxy and soft solder die bonding
Electrically conductive glue or solder
SIGC144T170R2C
8x ( 2.98x1.98 )
11.98 x 11.98
1.48 x 0.757
2
0.65mm ; max 1.2mm
143.52
3200 nm AlSiCu
280
150
Ni Ag –system
Al, <500µm
Photoimide
93 pcs
sawn on foil
Package
G
mm
mm
µm
C
E
2

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SIGC144T170R2C_09 Summary of contents

Page 1

IGBT Chip in NPT-technology Features: 1700V NPT technology 280 µm chip short circuit prove positive temperature coefficient easy paralleling Chip Type V CE SIGC144T170R2C 1700V Mechanical Parameter Raster size Emitter pad size Gate pad size Area total Thickness Wafer size ...

Page 2

Maximum Ratings Parameter Collector-Emitter voltage collector current, limited by T Pulsed collector current, t limited Gate emitter voltage Junction temperature range Operating junction temperature 2 ) Short circuit data V = 15V, ...

Page 3

Further Electrical Characteristic Switching characteristics and thermal properties are depending strongly on module design and mounting technology and can therefore not be specified for a bare die. Edited by INFINEON Technologies, AIM IMM, L7361M, Edition 2.1, 11.11.2009 SIGC144T170R2C ...

Page 4

Chip Drawing E = Emitter G = Gate T = Test pad do not contact Edited by INFINEON Technologies, AIM IMM, L7361M, Edition 2.1, 11.11.2009 SIGC144T170R2C ...

Page 5

Description AQL 0,65 for visual inspection according to failure catalogue Electrostatic Discharge Sensitive Device according to MIL-STD 883 Published by Infineon Technologies AG 81726 Munich, Germany © 2009 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in ...

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