EXB28V Matsushita Electric Works(Nais), EXB28V Datasheet - Page 8
EXB28V
Manufacturer Part Number
EXB28V
Description
Chip Resistor Array
Manufacturer
Matsushita Electric Works(Nais)
Datasheet
1.EXB28V.pdf
(10 pages)
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1.
2. Physical Dimensions
3. Specification
Part No.
Subject
3-1.Taping
Application Range
2-1. Stracture and reel dimensions shall be as shown in the figure below.
2-2. Carrier Tape Dimensions
When the test shall be operated with the below conditions, peel strength should be 0.049N to
0.49N, should not have flash and tear after peeling.
<Test Method>
Chip Resistor Array PRODUCT SPECIFICATION FOR INFORMATION
Minimum Bending Radius
This specification covers taping specification of EXB28V Type.
When carrier tape shall be bent by minimum bending radius (15 mm), no defection of chip and
no break of carrier tape. However minimum bending radius shall be tested for 1 times.
(mm)
(mm)
T
MATSUSHITA ELECTRONIC COMPONENTS Co.,LTD.
Carrier Tape
1.20 0.05
2.00 0.10
P1
A
Adhesive Tape
Carrier Tape(Paper)
EXB28V
Top Tape
P0
A
2.20 0.10
2.00 0.05
D0
P2
10
B
Chip hole
P2
Peeling Direction
8.00 0.20
4.00 0.10
P1
P0
Top Tape
W
Chip resistor array
Sprocket hole
3.50 0.05
0.52 0.05
11.4 1.0
9.0 1.0
F
T
Unit:mm
1.75 0.10
1.50
+0.10
D0
E
0
Spec. No.
151-EXB-28V02DE
9-8