S71GL256NB0 SPANSION [SPANSION], S71GL256NB0 Datasheet - Page 88

• Manufacturer Part Number: S71GL256NB0
• Description: Stacked Multi-chip Product (MCP)
• Manufacturer: SPANSION [SPANSION]

Notes:
1. PA = program address, PD = program data, D
2. Illustration shows device in word mode.
AC Characteristics
Notes:
1. Not 100% tested.
2. CE#, OE# = V
3. OE# = V
4. See Figure 9 and
88
Addresses
RY/BY#
ACC
WE#
Data
OE#
CE#
V
IL
CC
V
V
IL
IL
HH
or V
t
Table
VCS
IH
13
Program Command Sequence (last two cycles)
t
VHH
for test specifications.
555h
t
CS
t
Figure 15. Accelerated Program Timing Diagram
WC
Figure 14. Program Operation Timings
A0A0h
t
WP
t
DS
S29GLxxxN MirrorBit
t
DH
t
CH
A d v a n c e
t
WPH
OUT
t
AS
PA
is the true data at the program address.
t
AH
PD
TM
Flash Family
I n f o r m a t i o n
t
BUSY
t
WHWH1
Read Status Data (last two cycles)
PA
Status
t
VHH
S29GLxxxN_00_A4 June 14, 2004
V
IL
D
OUT
or V
PA
t
IH
RB