S71WS-N SPANSION [SPANSION], S71WS-N Datasheet - Page 7

• Manufacturer Part Number: S71WS-N
• Description: Stacked Multi-Chip Product (MCP)
• Manufacturer: SPANSION [SPANSION]

4. MCP Block Diagram
5. Connection Diagrams/Physical Dimensions
5.1
July 19, 2006 S71WS-N_00_A6
Special Handling Instructions for FBGA Packages
Notes:
1. R-CRE is only present in CellularRAM-compatible pSRAM.
2. For 1 Flash + pSRAM, F1-CE# = CE#. For 2 Flash + pSRAM, CE# = F1-CE# and F2-CE# is the chip-enable pin for the second Flash.
3. Only needed for S71WS512N.
4. For the 128M pSRAM devices, there are 23 shared addresses.
This section contains the I/O designations and package specifications for the S71WS-N.
Special handling is required for Flash Memory products in FBGA packages.
Flash memory devices in FBGA packages may be damaged if exposed to ultrasonic cleaning methods. The
package and/or data integrity may be compromised if the package body is exposed to temperatures above
150°C for prolonged periods of time.
Flash-only Address
D a t a
Shared Address
(Note
(Note
(Note
1)
2)
2)
R-CE1#
F1-CE#
F-RST#
F2-CE#
S h e e t
R-UB#
R-LB#
R-VCC
R-CRE
R-CE2
AVD#
F-VCC
WP#
WE#
OE#
ACC
CLK
( A d v a n c e
S71WS-N
22
22
I n f o r m a t i o n )
WP#
ACC
CE#
OE#
WE#
RESET#
AVD#
CLK
CE#
WE#
OE#
UB#
LB#
CRE#
AVD#
CLK
V
V CC
CC
I/O15 to I/O0
DQ15 to DQ0
Flash 1
(Note
pSRAM
V
WAIT#
V ID
CCQ
V SSQ
4)
RDY
Flash 2
16
16
V
DQ15 to DQ0
RDY
SS
5